34 FN6667.5 December 13, 2011 Package Outline Drawing L20.5.5x4.0 20 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE Rev 2, 9/09 0.30 (2.20) 1" />
參數(shù)資料
型號(hào): ISL12020MIRZ-EVALZ
廠商: Intersil
文件頁數(shù): 28/34頁
文件大?。?/td> 0K
描述: EVAL BOARD FOR ISL12020MIRZ
產(chǎn)品培訓(xùn)模塊: Solutions for Industrial Control Applications
標(biāo)準(zhǔn)包裝: 1
主要目的: 計(jì)時(shí),實(shí)時(shí)時(shí)鐘(RTC)
嵌入式:
已用 IC / 零件: ISL12020M
主要屬性: 128 B SRAM,可編程夏令時(shí)
次要屬性: I²C 接口
已供物品:
ISL12020M
34
FN6667.5
December 13, 2011
Package Outline Drawing
L20.5.5x4.0
20 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE
Rev 2, 9/09
0.30
(2.20)
10X 0.70
2.10
2X 1.50
(4.95)
10 X 0.25
2X 2.45
PACKAGE
10X 0.45
(4.40)
(3.0)
(4.85)
(4.95)
10X 0.50
(4.50 )
10X 0.25
(2X 0.20)
(0.10)
0.16
0.68
BOTTOM VIEW
DETAIL "X"
SIDE VIEW
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
Dimensions in (
) for Reference Only.
Tiebar shown (if present) is a non-functional feature.
between 0.015mm and 0.30mm from the terminal tip.
Unless otherwise specified, tolerance : Decimal ± 0.05
Dimensioning and tolerancing conform to AMSEY14.5m-1994.
located within the zone indicated. The pin #1 indentifier may be
The configuration of the pin #1 identifier is optional, but must be
Dimension applies to the metallized terminal and is measured
either a mold or mark feature.
6.
5.
Dimensions are in millimeters.
4.
3.
2.
1.
Angular ±2°
7. No other electrical connection allowed under backside of X1 or X2 areas.
NOTES:
SEATING PLANE
0.08 C
0.10 C
2X1.30
0.300
0.30
0.66
5.5
A
4.0
B
2X
0.10
PIN 1
INDEX AREA
0.35
R0.0750
10X 0.50
0.20
2.25
2.45
2.20
2.10
18X 0.50
C
0.2 REF
0-0.05
1.30
5
SEE DETAIL "X"
C
6
A
0.10M CB
4
0.10
1
10
11
20
10X 0.25
10 x 0.25
10 X 0.50
PIN #1
BOUNDARY
INDEX AREA
8. Soldering required to PCB for X1 and X2 pads to separate and
non-connected metal pads.
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