ISL12020M
6
FN6667.5
December 13, 2011
Absolute Maximum Ratings
Thermal Information
Voltage on VDD, VBAT and IRQ/FOUT pins
(Respect to Ground) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.0V
Voltage on SCL and SDA pins
(Respect to Ground) . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VDD + 0.3V
Voltage on X1 and X2 pins
(Respect to Ground, Note
6) . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 2.5V
ESD Rating
Human Body Model
(Per MIL-STD-883 Method 3014) . . . . . . . . . . . . . . . . . . . . . . . . . . >3kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >300V
Latch Up (Tested per JESD-78B; Class 2, Level A) . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100mA or 1.5 * VMAX Input
Shock Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . 5000g, 0.3ms, 1/2 sine
Vibration (Ultrasound cleaning not advised) . . . . . . . . . . . 20g/10-2000Hz,
Thermal Resistance (Typical)
JA (°C/W)
JC (°C/W)
20 Lead DFN (Notes
4, 5) . . . . . . . . . . . . . . 40
3.5
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+85°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Pb-Free Reflow Profile (Note
7). . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4.
JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
5. For
JC, the “case temp” location is the center of the exposed metal pad on the package underside.
6. The X1 and X2 pins are connected internally to a crystal and should be a floating electrical connection.
7. The ISL12020M Oscillator Initial Accuracy can change after solder reflow attachment. The amount of change will depend on the reflow temperature
and length of exposure. A general rule is to use only one reflow cycle and keep the temperature and time as short as possible. Changes on the order
of ±1ppm to ±3ppm can be expected with typical reflow profiles.
DC Operating Characteristics - RTC Test Conditions: VDD = +2.7 to +5.5V, TA= -40°C to +85°C,unlessotherwise stated. Boldface
limits apply over the operating temperature range, -40°C to +85°C.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
VDD
Main Power Supply
2.7
5.5
V
VBAT
Battery Supply Voltage
1.8
5.5
IDD1
Supply Current. (I2Cnot active,
temperature conversion not active, FOUT
not active)
VDD = 5V
4.1
15
A
VDD = 3V
3.5
14
A
IDD2
Supply Current. (I2C Active, Temperature
Conversion not Active, FOUT not Active)
VDD = 5V
200
500
A
IDD3
Supply Current. (I2Cnot Active,
Temperature Conversion Active, FOUT not
Active)
VDD = 5V
120
400
A
IBAT
Battery Supply Current
VDD = 0V, VBAT = 3V, TA =+25°C
1.0
1.6
A
VDD = 0V, VBAT = 3V
1.0
5.0
A
IBATLKG
Battery Input Leakage
VDD = 5.5V, VBAT = 1.8V
100
nA
ILI
Input Leakage Current on SCL
VIL = 0V, VIH = VDD
-1.0
±0.1
1.0
A
ILO
I/O Leakage Current on SDA
VIL = 0V, VIH = VDD
-1.0
±0.1
1.0
A
VBATM
Battery Level Monitor Threshold
-100
+100
mV
VPBM
Brownout Level Monitor Threshold
-100
+100
mV
VTRIP
VBAT Mode Threshold
2.0
2.2
2.4
V
VTRIPHYS VTRIP Hysteresis
30
mV
VBATHYS VBAT Hysteresis
50
mV
Fout25°C Oscillator Initial Accuracy
VDD = 3.3V, TA = +25°C
±2
ppm
FoutT
Oscillator Stability vs Temperature
VDD = 3.3V
-5
+5
ppm