and temporarily unprotected to make changes in
the application. Each block can be programmed
and erased over 100,000 cycles.
Instructions for Read/Reset,Auto Select for read-
ing the Electronic Signature or Block Protection
status,Programming,Blockand ChipErase,Erase
Suspend and Resume are written to the device in
cyclesof commandstoa CommandInterfaceusing
standardmicroprocessorwrite timings.
The device is offeredin TSOP48(12 x 20mm)and
SO44packages.Both normaland reversepinouts
are availablefor the TSOP48package.
Organisation
TheM29W800is organisedas 1 Mx8 or512Kx16
bitsselectableby the BYTEsignal.When BYTEis
Low theByte-wide x8 organisationis selectedand
the address lines are DQ15A–1 and A0-A18. The
Data Input/Output signal DQ15A–1 acts as ad-
dress line A–1 which selects the lower or upper
Byte of the memoryword for output on DQ0-DQ7,
DQ8-DQ14 remain at High impedance. When
BYTEis Highthe memoryuses the addressinputs
A0-A18 and the Data Input/Outputs DQ0-DQ15.
Memory control is provided by Chip Enable E,
Output Enable G and Write EnableW inputs.
AReset/BlockTemporaryUnprotection RPtri-level
input provides a hardware reset when pulled Low,
andwhenheldHigh(atV
ID
)temporarily unprotects
blocks previously protected allowing them to be
programedanderased.EraseandProgramopera-
tions are controlled by an internal Program/Erase
Controller(P/E.C.). StatusRegisterdata output on
DQ7providesa Data Pollingsignal, and DQ6and
DQ2provideToggle signalsto indicatethe stateof
DESCRIPTION
(Cont’d)
the P/E.C operations. A Ready/Busy RB output
indicatesthe completionof theinternalalgorithms.
MemoryBlocks
The devicesfeature asymmetrically blockedarchi-
tectureprovidingsystemmemory integration.Both
M29W800TandM29W800Bdeviceshavean array
of 19 blocks, one Boot Block of 16 KBytes or 8
KWords, two Parameter Blocks of 8 KBytes or 4
KWords, one Main Block of 32 KBytes or 16
KWordsand fifteenMainBlocksof 64KBytesor 32
KWords.TheM29W800ThastheBootBlockatthe
top of the memory address space and the
M29W800B locates the Boot Block starting at the
bottom. The memory maps are showed in Figure
3.
Each block can be erased separately, any combi-
nation of blocks can be specified for multi-block
eraseor the entire chipmay beerased.The Erase
operations are managed automatically by the
P/E.C. The block erase operation can be sus-
pended in order to read from or program to any
block not beingersased, and then resumed.
Block protectionprovides additional data security.
Each block can be separatelyprotected or unpro-
tectedagainst Program or Erase on programming
equipment.All previously protected blocks can be
temporarily unprotectedin the application.
Bus Operations
The following operations can be performed using
theappropriatebus cycles:Read(Array,Electronic
Signature, Block Protection Status), Write com-
mand, OutputDisable,Standby,Reset, Block Pro-
tection, Unprotection, Protection Verify,
Unprotection Verify and Block Temporary Unpro-
tection.See Tables4 and 5.
Symbol
Parameter
Value
Unit
T
A
Ambient Operating Temperature
(3)
–40 to 85
°
C
T
BIAS
Temperature Under Bias
–50 to 125
°
C
T
STG
V
IO(2)
Storage Temperature
–65 to 150
°
C
Input or Output Voltages
–0.6to 5
V
V
CC
Supply Voltage
–0.6to 5
V
V
(A9, E, G, RP)
(2)
A9, E, G, RP Voltage
–0.6to 13.5
V
Notes:
1. Except for therating ”O(jiān)perating Temperature Range”, stresses above those listed in theTable ”AbsoluteMaximum Ratings”
may cause permanentdamage to thedevice. These are stress ratings only and operation of the device at these or any other
conditions above those indicated in the Operatingsections of this specification is not implied.Exposure to Absolute Maximum
Rating conditions for extendedperiods may affectdevice reliability.Refer also tothe STMicroelectronics SURE Program and other
relevant quality documents.
2. Minimum Voltagemay undershoot to –2V during transitionand for less than 20ns.
3. Depends on range.
Table2. Absolute MaximumRatings
(1)
3/33
M29W800T M29W800B