參數(shù)資料
型號: M7010R-066ZA1T
廠商: 意法半導體
英文描述: 16K x 68-bit Entry NETWORK SEARCH ENGINE
中文描述: 16K的× 68位進入網(wǎng)絡搜索引擎
文件頁數(shù): 65/67頁
文件大小: 449K
代理商: M7010R-066ZA1T
65/67
M7010R
PACKAGE MECHANICAL INFORMATION
Figure 46. PBGA-Z00 – 272-ball Plastic Ball Grid Array Package Outline
Note: Drawing is not to scale.
Table 41. PBGA-Z00 – 272-ball Plastic Ball Grid Array Package Mechanical Data
Note: 1. Maximum mounted height is 2.45mm based on a 0.65mm ball pad diameter. Solder paste is 0.15mm thickness and 0.65mm in di-
ameter.
2. The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink, or metallized markings, or other feature
of package body or integral heatslug.
3. A distinguished feature is allowable on the bottom surface of the package to identify the terminal A1 corner.
4. Exact shape of each corner is optional.
Symb
mm
inches
Typ
Min
Max
Typ
Min
Max
A
(4)
27.00
26.80
27.20
(1)
1.102
1.094
1.110
(1)
A1
(2,3)
0.60
0.50
0.70
0.024
0.020
0.029
A2
1.63
1.90
0.067
0.078
B
(4)
27.00
26.80
27.20
1.102
1.094
1.110
b
0.75
0.60
0.90
0.031
0.024
0.037
D
27.00
26.80
27.20
1.102
1.094
1.110
D1
24.13
0.985
D2
24.00
0.980
E
27.00
26.80
27.20
1.102
1.094
1.110
E1
24.13
0.985
E2
24.00
0.980
e
1.27
0.052
ddd
0.20
0.008
A2
A1
1.17 REF.
0.56 REF.
E2
PIN #1
D2
ddd C
0.220 (3x)
C
B
A
e
e
E
E1
b
D1
D
2019181716151413121110987654321
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
0.300 C
0.100 C
S
A
b (272x)
B
S
PBGA-Z00
4.00*45 (4x)
30 TYP.
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