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| 型號： | MA31750 |
| 廠商： | Dynex Semiconductor Ltd. |
| 英文描述： | High Performance MIL-STD-1750 Microprocessor |
| 中文描述： | 高性能的MIL - STD - 1750微處理器 |
| 文件頁數(shù)： | 42/42頁 |
| 文件大小： | 436K |
| 代理商： | MA31750 |
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MA31750
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14. ORDERING INFORMATION
Device Iteration
S
R
Q
Radiation Hard Processing
100 kRads (Si) Guaranteed
300 kRads (Si) Guaranteed
Radiation Tolerance
A
F
Pin Grid Array
Flatpack (Solder Seal)
Package Type
QA/QCI Process
(See Section 9 Part 4)
Test Process
(See Section 9 Part 3)
Assembly Process
(See Section 9 Part 2)
L
C
D
E
B
S
Rel 0
Rel 1
Rel 2
Rel 3/4/5/STACK
Class B
Class S
Reliability Level
xMAx31750xxxxx
Unique Circuit Designator
For details of reliability, QA/QC, test and assembly
options, see ‘Manufacturing Capability and Quality
Assurance Standards’ - SOS Handbook Section 9.
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
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Dynex Semiconductor 2000 Publication No. DS3748-8 Issue No. 8.0 January 2000HEADQUARTERS OPERATIONSDoddington Road, Lincoln.Tel: 00-44-(0)1522-500500DYNEX POWER INC.Nepean, Ontario, Canada K2E 7W6.Fax: 613.723.1518This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regardedreserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute anyto ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injuryAll brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.e-mail: power_solutions@dynexsemi.comDynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:- This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.