參數(shù)資料
型號: MCIMX257DVM4
廠商: Freescale Semiconductor
文件頁數(shù): 85/153頁
文件大?。?/td> 0K
描述: IC MPU I.MX25 COMM 400MAPBGA
標(biāo)準(zhǔn)包裝: 90
系列: i.MX25
核心處理器: ARM9
芯體尺寸: 32-位
速度: 400MHz
連通性: 1 線,CAN,EBI/EMI,以太網(wǎng),I²C,MMC,智能卡,SPI,SSI,UART/USART,USB OTG
外圍設(shè)備: DMA,I²S,LCD,POR,PWM,WDT
輸入/輸出數(shù): 128
程序存儲器類型: 外部程序存儲器
RAM 容量: 144K x 8
電壓 - 電源 (Vcc/Vdd): 1.15 V ~ 1.52 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 3x12b
振蕩器型: 外部
工作溫度: -20°C ~ 70°C
封裝/外殼: 400-LFBGA
包裝: 托盤
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 10
Freescale Semiconductor
37
Table 28 shows AC parameters for SDRAM pbijtov18_33_ddr_clk I/O.
Output pad slew rate2 (standard drive)
tps
25 pF
50 pF
0.38/0.41
0.20/0.22
0.59/0.60
0.31/0.32
0.89/0.82
0.47/0.43
V/ns
Output pad dI/dt3 (max. drive)
tdit
25 pF
50 pF
89
94
198
209
398
421
mA/ns
Output pad dI/dt3 (high drive)
tdit
25 pF
50 pF
59
62
132
139
265
279
mA/ns
Output pad dI/dt3 (standard drive)
tdit
25 pF
50 pF
29
31
65
69
132
139
mA/ns
Input pad transition times4
trfi
1.0 pF
0.07/0.08
0.11/0.12
0.16/0.20
ns
Input pad propagation delay, 50%–50%4
tpi
1.0 pF
0.35/1.17
0.63/1.53
1.16/2.04
ns
Input pad propagation delay, 40%–60%4
tpi
1.18/1.99
1.45/2.35
1.97/2.85
1 Maximum condition for tpr, tpo, tpi, and tpv: wcs model, 1.1 V, I/O 3.0 V, and 105 °C. Minimum condition for tpr, tpo, and tpv:
bcs model, 1.3 V, I/O 3.6 V and –40 °C. Input transition time from core is 1 ns (20%–80%).
2 Minimum condition for tps: wcs model, 1.1 V, I/O 3.0 V, and 105 °C. tps is measured between VIL to VIH for rising edge and
between VIH to VIL for falling edge.
3 Maximum condition for tdit: bcs model, 1.3 V, I/O 3.6 V, and –40 °C.
4 Maximum condition for tpi and trfi: wcs model, 1.1 V, I/O 3.0 V and 105 °C. Minimum condition for tpi and trfi: bcs model, 1.3 V,
I/O 3.6 V and –40 °C. Input transition time from pad is 5 ns (20%–80%).
Table 28. AC Parameters for SDRAM pbijtov18_33_ddr_clk I/O
Parameter
Symbol
Load
Condition
Min.
Rise/Fall
Typ.
Max.
Rise/Fall
Units
Duty cycle
Fduty
40
50
60
%
Clock frequency1
f
133
MHz
Output pad transition times1 (max. drive)
tpr
25 pF
50 pF
0.82/0.87
1.56/1.67
1.14/1.13
2.13/2.09
1.62/1.50
3.015/2.7
7
ns
Output pad transition times1 (high drive)
tpr
25 pF
50 pF
1.23/1.31
2.31/2.47
1.71/1.68
3.22/3.12
2.39/2.22
4.53/4.16
ns
Output pad transition times1 (standard drive)
tpr
25 pF
50 pF
2.44/2.60
4.65/4.99
3.38/3.27
6.38/6.23
4.73/4.38
9.05/8.23
ns
Output pad propagation delay1 (max. drive),
50%–50% input signals and crossing of output signals
tpo
15 pF
35 pF
1.50/1.40
1.95/1.85
2.23/2.07
2.81/2.66
3.28/3.04
4.06/3.82
ns
Output pad propagation delay1 (high drive),
50%–50% input signals and crossing of output signals
tpo
15 pF
35 pF
1.69/1.59
2.35/2.25
2.48/2.32
3.35/3.19
3.63/3.38
4.80/4.56
ns
Output pad propagation delay1 (standard drive),
50%–50% input signals and crossing of output signals
tpo
15 pF
35 pF
2.26/2.15
3.59/3.49
3.24/3.08
4.98/4.82
4.66/4.42
7.00/6.75
ns
Output pad propagation delay1 (max. drive),
40%–60% input signals and crossing of output signals
tpo
15 pF
35 pF
1.67/1.57
2.11/2.02
2.39/2.24
2.97/2.82
3.45/3.21
4.23/3.99
ns
Table 27. AC Parameters for SDRAM I/O (continued)
Parameter
Symbol
Load
Condition
Min.
Rise/Fall
Typ.
Max.
Rise/Fall
Units
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