參數(shù)資料
型號: MCIMX258CJM4
廠商: Freescale Semiconductor
文件頁數(shù): 55/153頁
文件大?。?/td> 0K
描述: MPU IMX25 IND 400-MAPBGA
特色產(chǎn)品: MCIMX25 Applications Processors
標準包裝: 90
系列: i.MX25
核心處理器: ARM9
芯體尺寸: 32-位
速度: 400MHz
連通性: 1 線,CAN,EBI/EMI,以太網(wǎng),I²C,MMC,智能卡,SPI,SSI,UART/USART,USB OTG
外圍設(shè)備: DMA,I²S,LCD,POR,PWM,WDT
輸入/輸出數(shù): 128
程序存儲器類型: 外部程序存儲器
RAM 容量: 144K x 8
電壓 - 電源 (Vcc/Vdd): 1.15 V ~ 1.52 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 3x12b
振蕩器型: 外部
工作溫度: -40°C ~ 85°C
封裝/外殼: 400-LFBGA
包裝: 托盤
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 10
148
Freescale Semiconductor
Table 106 lists the 12
×12 mm package i.MX25 no connect contact assignments.
4.8
i.MX25 12x12 Package Ball Map
Table 107 shows the i.MX25 12
×12 package ball map.
WIPER
AA17
ADC
ANALOG
-
INAUX0
AA15
ADC
ANALOG
-
INAUX1
W14
ADC
ANALOG
-
INAUX2
AB16
ADC
ANALOG
-
1 The state immediately after reset and before ROM firmware or software has executed.
2 During power-on reset this port acts as input for fuse override signal.
3 During power-on reset this port acts as output for diagnostic signal.
Table 106. 12
×12 mm Package i.MX25 No Connect Contact Assignments
Signal Name
Contact Assignment
NC_BGA_E4
E4
NC_BGA_L4
L4
Table 107. i.MX25 12
×12 Package Ball Map
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
A
QG
ND
EB0
OE
A14
A16
A18
A22
BC
LK
DQM
1
SD9
SD1
0
SD7
SD0
SD3
SD5
SD
CKE0
SDBA0
CS3
A1
A0
A4
QG
ND
B
ECB
QG
ND
LBA
EB1
A10
A20
A24
SD14
SD12
SD11
SD6
SD2
SD4
QG
ND
SD
W
E
CAS
CS2
A2
A5
A7
QG
ND
A12
C
NFRE_
B
CS0
A11
CS1_
D
2
D
NFCLE
CS5
CS1
RW
A15
A21
A25
SD1
5
SD8
DQ
M0
SD1
SDCLK
SDCLK_B
RAS
SDBA1
A3
A6
A9
A13
CSI
_
D6
E
NFW
E
_B
NF
ALE
NC_BGA_
E4
CS4
A1
7
A1
9
A2
3
SD13
SD
QS1
SD
QS0
NVCC_EMI
2
MA1
0
QGND
A8
CSI
_
D4
CSI
_
D8
F
D1
D0
NF_
C
E0
QG
N
D
QG
N
D
NVCC_EMI
2
SDCKE1
QG
N
D
CSI
_
D3
CSI
_
D7
CSI
_
MCLK
Table 105. 12x12 mm Package i.MX25 Signal Contact Assignment (continued)
Contact Name
Contact
Assignment
Power Rail
I/O Buffer Type
Direction after
Reset1
Configuration
after Reset1
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