THERMAL ADDENDUM (REV 2.0) ADDITIONAL DOCUMENT" />
參數(shù)資料
型號： MCZ33742EG
廠商： Freescale Semiconductor
文件頁數(shù)： 63/71頁
文件大?。?/td> 0K
描述： IC SYSTEM BASIS CHIP CAN 28-SOIC
標(biāo)準(zhǔn)包裝： 26
應(yīng)用： 自動
電流 - 電源： 42mA
電源電壓： 5.5 V ~ 18 V
工作溫度： -40°C ~ 125°C
安裝類型： 表面貼裝
封裝/外殼： 28-SOIC（0.295"，7.50mm 寬）
供應(yīng)商設(shè)備封裝： 28-SOIC W
包裝： 管件
產(chǎn)品目錄頁面： 808 (CN2011-ZH PDF)
Analog Integrated Circuit Device Data
66
Freescale Semiconductor
33742
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Introduction
This thermal addendum is provided as a supplement to the MC33742
technical datasheet. The addendum provides thermal performance
information that may be critical in the design and development of system
applications. All electrical, application, and packaging information is
provided in the data sheet.
Packaging and Thermal Considerations
The MC33742 is offered in a 28 pin SOICW exposed pad, single die
package. There is a single heat source (P), a single junction temperature
(TJ), and thermal resistance (RJA).
The stated values are solely for a thermal performance comparison of
one package to another in a standardized environment. This methodology
is not meant to and will not predict the performance of a package in an
application-specific environment. Stated values were obtained by
measurement and simulation according to the standards listed below.
Standards
Table 44. Thermal Performance Comparison
Thermal Resistance
[
C/W]
41
10
68
RJC
220
Notes:
1.
Per JEDEC JESD51-2 at natural convection, still air
condition.
2.
2s2p thermal test board per JEDEC JESD51-7.
3.
Per JEDEC JESD51-8, with the board temperature on the
center trace near the center lead.
4.
Single layer thermal test board per JEDEC JESD51-3.
5.
Thermal resistance between the die junction and the
package top surface; cold plate attached to the package top
surface and remaining surfaces insulated.
28-PIN SOICW
33742SOICW
EG SUFFIX (PB-FREE)
98ASB42345B
28-PIN SOICW
Note For package dimensions, refer to
98ASB42345B.
TJ
=
RJA
.
P
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCZ33742EGR2 功能描述:網(wǎng)絡(luò)控制器與處理器 IC SBC-E-HS-CAN RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
MCZ33742SEG 功能描述:網(wǎng)絡(luò)控制器與處理器 IC SBC-E-HS-CAN RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
MCZ33742SEGR2 功能描述:網(wǎng)絡(luò)控制器與處理器 IC SBC-E-HS-CAN RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
MCZ33780EG 功能描述:多路器開關(guān) IC DBUS MASTER RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 開關(guān)數(shù)量:4 開啟電阻（最大值）:7 Ohms 開啟時間（最大值）: 關(guān)閉時間（最大值）: 傳播延遲時間:0.25 ns 工作電源電壓:2.3 V to 3.6 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UQFN-16
MCZ33780EG 制造商:Freescale Semiconductor 功能描述:DUAL DBUS MASTER INTERFACE 16SOIC
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