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參數(shù)資料
| 型號： | MPC7410RX500LX |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 500 MHz, RISC PROCESSOR, CBGA360 |
| 封裝： | 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件頁數(shù)： | 44/44頁 |
| 文件大?。?/td> | 885K |
| 代理商： | MPC7410RX500LX |
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MPC7410 RISC Microprocessor Hardware Specifications
9
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Electrical and Thermal Characteristics
Table 4 provides the package thermal characteristics for the MPC7410.
The MPC7410 incorporates a thermal management assist unit (TAU) composed of a thermal sensor,
digital-to-analog converter, comparator, control logic, and dedicated special-purpose registers (SPRs). See
the MPC7400 RISC Microprocessor User’s Manual for more information on the use of this feature.
Specifications for the thermal sensor portion of the TAU are found in Table 5.
Table 3. Recommended Operating Conditions1
Characteristic
Symbol
Recommended
Value
Unit
Notes
Core supply voltage
Vdd
1.8 V ± 100 mV
V
PLL supply voltage
AVdd
1.8 V ± 100 mV
V
L2 DLL supply voltage
L2AVdd
1.8 V ± 100 mV
V
Processor bus supply
voltage
BVSEL = 0
OVdd
1.8 V ± 100 mV
V
BVSEL = HRESET
OVdd
2.5 V ± 100 mV
V
BVSEL = HRESET or
BVSEL = 1
OVdd
3.3 V ± 100 mV
V
2
L2 bus supply voltage
L2VSEL = 0
L2OVdd
1.8 V ± 100 mV
V
L2VSEL = HRESET or
L2VSEL = 1
L2OVdd
2.5 V ± 100 mV
V
Input voltage
Processor bus and
JTAG Signals
Vin
GND to OVdd
V
L2 Bus
Vin
GND to L2OVdd
V
Die-junction temperature
Tj
0 to 105
°C
Notes:
1. These are the recommended and tested operating conditions. Proper device operation outside of these
conditions is not guaranteed.
2. MPC7410RXnnnLE (Rev 1.4) and later only.
Table 4. Package Thermal Characteristics
Characteristic
Symbol
Value
Rating
CBGA package thermal resistance, junction-to-case thermal resistance
(typical)
θ
JC
0.03
°C/W
CBGA package thermal resistance, die junction-to-lead thermal
resistance (typical)
θ
JB
3.8
°C/W
CBGA package thermal resistance, die junction-to-ambient resistance
(typical)
θ
JA
17.9
°C/W
Note: Refer to Section 1.8, “System Design Information,” for more details about thermal management.
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