參數(shù)資料
型號(hào)： MPC7455
廠商： 飛思卡爾半導(dǎo)體(中國(guó))有限公司
英文描述： RISC Microprocessor Hardware Specifications
中文描述： RISC微處理器硬件規(guī)格
文件頁(yè)數(shù)： 13/64頁(yè)
文件大小： 1127K
代理商： MPC7455
MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1
Freescale Semiconductor
13
Electrical and Thermal Characteristics
Table 5
provides the package thermal characteristics for the MPC7455.
Table 6
provides the DC electrical characteristics for the MPC7455.
Table 5. Package Thermal Characteristics
6
Characteristic
Symbol
Value
Unit
Notes
MPC7445
MPC7455
Junction-to-ambient thermal resistance, natural
convection
R
θ
JA
22
20
°C/W
1, 2
Junction-to-ambient thermal resistance, natural
convection, four-layer (2s2p) board
R
θ
JMA
14
14
°C/W
1, 3
Junction-to-ambient thermal resistance, 200 ft/min
airflow, single-layer (1s) board
R
θ
JMA
16
15
°C/W
1, 3
Junction-to-ambient thermal resistance, 200 ft/min
airflow, four-layer (2s2p) board
R
θ
JMA
11
11
°C/W
1, 3
Junction-to-board thermal resistance
R
θ
JB
6
6
°C/W
4
Junction-to-case thermal resistance
R
θ
JC
<0.1
<0.1
°C/W
5
Notes
:
1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the calculated case temperature. The actual value of R
θ
JC
for the part is less
than 0.1°C/W.
6. Refer to
Section 9.8, “Thermal Management Information,”
for more details about thermal management.
Table 6. DC Electrical Specifications
At recommended operating conditions. See
Table 4
.
Characteristic
Nominal
Bus
Voltage
1
Symbol
Min
Max
Unit
Notes
Input high voltage
(all inputs except SYSCLK)
1.5
V
IH
GV
DD
×
0.65
GV
DD
+ 0.3
V
6
1.8
V
IH
OV
DD
/GV
DD
×
0.65 OV
DD
/GV
DD
+ 0.3
V
2.5
V
IH
1.7
OV
DD
/GV
DD
+ 0.3
V
Input low voltage
(all inputs except SYSCLK)
1.5
V
IL
–0.3
GV
DD
×
0.35
V
6
1.8
V
IL
–0.3
OV
DD
/GV
DD
×
0.35
V
2.5
V
IL
–0.3
0.7
V
SYSCLK input high voltage
—
CV
IH
1.4
OV
DD
+ 0.3
V
SYSCLK input low voltage
—
CV
IL
–0.3
0.4
V
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MPC745BPX350LE 功能描述:微處理器 - MPU 255 PBGAREV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC745BVT300LE 功能描述:微處理器 - MPU GF REV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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