參數(shù)資料
型號(hào): MPC7455
廠商: 飛思卡爾半導(dǎo)體(中國(guó))有限公司
英文描述: RISC Microprocessor Hardware Specifications
中文描述: RISC微處理器硬件規(guī)格
文件頁(yè)數(shù): 42/64頁(yè)
文件大?。?/td> 1127K
代理商: MPC7455
MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1
42
Freescale Semiconductor
Package Description
8.2 Mechanical Dimensions for the MPC7445, 360 CBGA
Figure 20
provides the mechanical dimensions and
bottom surface nomenclature for the MPC7445, 360 CBGA
package.
Figure 20. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC7445,
360 CBGA Package
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. TOP SIDE A1 CORNER INDEX IS A
METALIZED FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE A1 CORNER IS
DESIGNATED WITH A BALL MISSING
FROM THE ARRAY.
0.2
C
A
A
360X
D
2X
A1 CORNER
E
e
0.2
2X
C
B
1 2 3 4 5 6 7 8 9 10 111213141516
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
B
0.3
0.15
b
A
0.15 A
171819
U
W
V
Millimeters
DIM
MIN
MAX
A
2.72
3.20
A1
0.80
1.00
A2
1.10
1.30
A3
0.6
b
0.82
0.93
D
25.00 BSC
D1
6.15
D2
12.15
12.45
e
1.27 BSC
E
25.00 BSC
E1
11.1
E2
7.45
E3
8.75
9.20
Capacitor Region
1
D1
E2
E1
A
A1
A2
A3
E3
D2
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