參數(shù)資料
型號: MPC745CVT350LE
廠商: Freescale Semiconductor
文件頁數(shù): 22/56頁
文件大小: 0K
描述: MCU HIP4DP 350MHZ 255-PBGA
標準包裝: 60
系列: MPC7xx
處理器類型: 32-位 MPC7xx PowerPC
速度: 350MHz
電壓: 2V
安裝類型: 表面貼裝
封裝/外殼: 255-BBGA,F(xiàn)CBGA
供應商設備封裝: 255-FCPBGA(21x21)
包裝: 托盤
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
Freescale Semiconductor
29
Pinout Listings
Table 15 provides the pinout listing for the MPC755, 360 PBGA and CBGA packages.
VOLTDET
F3
High
Output
6
Notes:
1. OVDD supplies power to the processor bus, JTAG, and all control signals; and VDD supplies power to the processor core and
the PLL (after filtering to become AVDD). These columns serve as a reference for the nominal voltage supported on a given
signal as selected by the BVSEL pin configuration of Table 2 and the voltage supplied. For actual recommended value of Vin
or supply voltages, see Table 3.
2. These are test signals for factory use only and must be pulled up to OVDD for normal machine operation.
3. This pin must be pulled up to OVDD for proper operation of the processor interface. To allow for future I/O voltage changes,
provide the option to connect BVSEL independently to either OVDD or GND.
4. Uses 1 of 15 existing no connects in the MPC740, 255 BGA package.
5. Internal pull-up on die.
6. Internally tied to GND in the MPC745, 255 BGA package to indicate to the power supply that a low-voltage processor is
present. This signal is not a power supply input.
Caution: This differs from the MPC755, 360 BGA package.
Table 15. Pinout Listing for the MPC755, 360 BGA Package
Signal Name
Pin Number
Active
I/O
I/F Voltage 1
Notes
A[0:31]
A13, D2, H11, C1, B13, F2, C13, E5, D13, G7, F12, G3,
G6, H2, E2, L3, G5, L4, G4, J4, H7, E1, G2, F3, J7, M3,
H3, J2, J6, K3, K2, L2
High
I/O
OVDD
AACK
N3
Low
Input
OVDD
ABB
L7
Low
I/O
OVDD
AP[0:3]
C4, C5, C6, C7
High
I/O
OVDD
ARTRY
L6
Low
I/O
OVDD
AVDD
A8
2.0 V
BG
H1
Low
Input
OVDD
BR
E7
Low
Output
OVDD
BVSEL
W1
High
Input
OVDD
3, 5, 6
CI
C2
Low
Output
OVDD
CKSTP_IN
B8
Low
Input
OVDD
CKSTP_OUT
D7
Low
Output
OVDD
CLK_OUT
E3
Output
OVDD
DBB
K5
Low
I/O
OVDD
DBDIS
G1
Low
Input
OVDD
DBG
K1
Low
Input
OVDD
DBWO
D1
Low
Input
OVDD
Table 14. Pinout Listing for the MPC745, 255 PBGA Package (continued)
Signal Name
Pin Number
Active
I/O
I/F Voltage 1
Notes
相關PDF資料
PDF描述
MPC745CPX350LE MCU HIP4DP 350MHZ 255-PBGA
MPC745BVT350LE IC MPU PPC 350MHZ 255-FCPBGA
FMM44DSEN-S243 CONN EDGECARD 88POS .156 EYELET
MC68302CRC16C IC MPU NETWORK 16MHZ 132-PQA
MPC8533EVTARJA MPU POWERQUICC 783-PBGA
相關代理商/技術參數(shù)
參數(shù)描述
MPC75 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Metal Plate Cement Resistors
MPC750 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:MPC750 RISC Microprocessor
MPC75-103J 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Metal Plate Cement Resistors
MPC75-103K 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Metal Plate Cement Resistors
MPC75201J 功能描述:厚膜電阻器 - 透孔 MPC7 200R 5% RoHS:否 制造商:Caddock 電阻:27 kOhms 容差:1 % 功率額定值:8 W 溫度系數(shù):50 PPM / C 系列:MS 端接類型:Axial 電壓額定值:2 kV 工作溫度范圍:- 15 C to + 275 C 尺寸:8.89 mm Dia. x 23.11 mm L 封裝:Bulk