參數(shù)資料
型號(hào)： MPC745CVT350LE
廠商： Freescale Semiconductor
文件頁數(shù)： 44/56頁
文件大小： 0K
描述： MCU HIP4DP 350MHZ 255-PBGA
標(biāo)準(zhǔn)包裝： 60
系列： MPC7xx
處理器類型： 32-位 MPC7xx PowerPC
速度： 350MHz
電壓： 2V
安裝類型： 表面貼裝
封裝/外殼： 255-BBGA，F(xiàn)CBGA
供應(yīng)商設(shè)備封裝： 255-FCPBGA（21x21）
包裝： 托盤
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
Freescale Semiconductor
49
System Design Information
Figure 28. Thermalloy #2328B Heat Sink-to-Ambient Thermal Resistance Versus Airflow Velocity
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common
figure-of-merit used for comparing the thermal performance of various microelectronic packaging
technologies, one should exercise caution when only using this metric in determining thermal management
because no single parameter can adequately describe three-dimensional heat flow. The final die-junction
operating temperature, is not only a function of the component-level thermal resistance, but the
system-level design and its operating conditions. In addition to the component's power consumption, a
number of factors affect the final operating die-junction temperature—airflow, board population (local
heat flux of adjacent components), heat sink efficiency, heat sink attach, heat sink placement, next-level
interconnect technology, system air temperature rise, altitude, etc.
Due to the complexity and the many variations of system-level boundary conditions for today's
microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection,
and conduction) may vary widely. For these reasons, we recommend using conjugate heat transfer models
for the board, as well as, system-level designs.
1
3
5
7
8
00.511.522.533.5
Thermalloy #2328B Pin-Fin Heat Sink
Approach Air Velocity (m/s)
(25
× 28 × 15 mm)
2
4
6
Heat
Sink
The
rma
lResistance
(°
C/W)
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