參數(shù)資料
型號(hào): MPC745CVT350LE
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 28/56頁(yè)
文件大?。?/td> 0K
描述: MCU HIP4DP 350MHZ 255-PBGA
標(biāo)準(zhǔn)包裝: 60
系列: MPC7xx
處理器類型: 32-位 MPC7xx PowerPC
速度: 350MHz
電壓: 2V
安裝類型: 表面貼裝
封裝/外殼: 255-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 255-FCPBGA(21x21)
包裝: 托盤
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
34
Freescale Semiconductor
Package Description
7.3
Package Parameters for the MPC755 CBGA
The package parameters are as provided in the following list. The package type is 25
× 25 mm, 360-lead
ceramic ball grid array (CBGA).
Package outline
25
× 25 mm
Interconnects
360 (19
× 19 ball array – 1)
Pitch
1.27 mm (50 mil)
Minimum module height
2.65 mm
Maximum module height
3.20 mm
Ball diameter
0.89 mm (35 mil)
7.4
Mechanical Dimensions for the MPC755 CBGA
Figure 19 provides the mechanical dimensions and bottom surface nomenclature for the MPC755,
360 CBGA package.
Figure 19. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC755,
360 CBGA Package
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. TOP SIDE A1 CORNER INDEX IS A
METALIZED FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE A1 CORNER
IS DESIGNATED WITH A BALL MISSING
FROM THE ARRAY.
B
C
360X
e
123456789 10 111213141516
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
A
0.3
C
0.15
b
A
A1
A2
C
0.2 C
171819
U
W
V
Millimeters
DIM
Min
Max
A
2.65
3.20
A1
0.79
0.99
A2
1.10
1.30
A3
—0.60
b
0.82
0.93
D
25.00 BSC
D1
6.75
E
25.00 BSC
E1
7.87
e
1.27 BSC
0.2
D
2X
A1 CORNER
E
0.2
2X
A
E1
D1
A3
1
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