參數(shù)資料
型號: MPC8358EZQAGDGA
廠商: Freescale Semiconductor
文件頁數(shù): 85/95頁
文件大?。?/td> 0K
描述: MPU POWERQUICC II PRO 668-PBGA
標準包裝: 36
系列: MPC83xx
處理器類型: 32-位 MPC83xx PowerQUICC II Pro
速度: 400MHz
電壓: 1.2V
安裝類型: 表面貼裝
封裝/外殼: 668-BBGA 裸露焊盤
供應商設備封裝: 668-PBGA-PGE(29x29)
包裝: 托盤
MPC8358E PowerQUICC II Pro Processor Revision 2.1 PBGA Silicon Hardware Specifications, Rev. 3
86
Freescale Semiconductor
Thermal
23.2.3
Experimental Determination of Junction Temperature
To determine the junction temperature of the device in the application after prototypes are available, the
Thermal Characterization Parameter (
ΨJT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ = TT + (ΨJT × PD)
where:
TJ = junction temperature (°C)
TT = thermocouple temperature on top of package (°C)
Ψ
JT = junction-to-ambient thermal resistance (°C/W)
PD = power dissipation in the package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
23.2.4
Heat Sinks and Junction-to-Ambient Thermal Resistance
In some application environments, a heat sink will be required to provide the necessary thermal
management of the device. When a heat sink is used, the thermal resistance is expressed as the sum of a
junction to case thermal resistance and a case to ambient thermal resistance:
RθJA = RθJC + RθCA
where:
RθJA = junction-to-ambient thermal resistance (°C/W)
RθJC = junction-to-case thermal resistance (°C/W)
RθCA = case-to-ambient thermal resistance (°C/W)
RθJC is device related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RθCA. For instance, the user can change the size of the heat
sink, the airflow around the device, the interface material, the mounting arrangement on printed-circuit
board, or change the thermal dissipation on the printed-circuit board surrounding the device.
To illustrate the thermal performance of the devices with heat sinks, the thermal performance has been
simulated with a few commercially available heat sinks. The heat sink choice is determined by the
application environment (temperature, airflow, adjacent component power dissipation) and the physical
space available. Because there is not a standard application environment, a standard heat sink is not
required.
相關PDF資料
PDF描述
IDT7006S25PF8 IC SRAM 128KBIT 25NS 64TQFP
IDT7006S20PF8 IC SRAM 128KBIT 20NS 64TQFP
IDT71V67803S166PFGI IC SRAM 9MBIT 166MHZ 100TQFP
IDT71V67803S166BQG IC SRAM 9MBIT 166MHZ 165FBGA
MPC8358EVRAGDGA MPU POWERQUICC II PRO 668-PBGA
相關代理商/技術參數(shù)
參數(shù)描述
MPC8358EZUADDE 功能描述:微處理器 - MPU 8360 TBGA ENCRP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8358EZUADDEA 功能描述:微處理器 - MPU 8360 TBGA ENCRP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8358EZUADDGA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC8360E/MPC8358E PowerQUICC II Pro Processor
MPC8358EZUAGDEA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC8360E/MPC8358E PowerQUICC II Pro Processor
MPC8358EZUAGDG 功能描述:微處理器 - MPU 8360 TBGA ENCRP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324