參數(shù)資料
型號: MPC8358EZQAGDGA
廠商: Freescale Semiconductor
文件頁數(shù): 93/95頁
文件大?。?/td> 0K
描述: MPU POWERQUICC II PRO 668-PBGA
標準包裝: 36
系列: MPC83xx
處理器類型: 32-位 MPC83xx PowerQUICC II Pro
速度: 400MHz
電壓: 1.2V
安裝類型: 表面貼裝
封裝/外殼: 668-BBGA 裸露焊盤
供應(yīng)商設(shè)備封裝: 668-PBGA-PGE(29x29)
包裝: 托盤
MPC8358E PowerQUICC II Pro Processor Revision 2.1 PBGA Silicon Hardware Specifications, Rev. 3
Freescale Semiconductor
93
Ordering Information
includes an application modifier, which may specify special application conditions. Each part number also
contains a revision code that refers to the die mask revision number.
Table 79 shows the SVR settings by device and package type.
Table 78. Part Numbering Nomenclature1
1 Not all processor, platform, and QUICC Engine block frequency combinations are supported. For available frequency
combinations, contact your local Freescale sales office or authorized distributor.
MPC nnnn
e
t
pp
aa
a
A
Product
Code
Part
Identifier
Encryption
Acceleration
Temperature
Range
Package2
2 See Section 21, “Package and Pin Listings,for more information on available package types.
Processor
Frequency3
3 Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this specification
support all core frequencies. Additionally, parts addressed by part number specifications may support other maximum core
frequencies.
Platform
Frequency
QUICC
Engine
Frequency
Die
Revision
MPC
8358
Blank = Not
included
E = included
Blank =
0
°C TA to
105
°C TJ
C= –40
°C TA
to 105
°C TJ
ZQ = PBGA
VR = PBGA
(no lead)
e300 core speed
AD = 266 MHz
AG = 400 MHz
D = 266 MHz
G = 400 MHz
A = revision
2.1 silicon
Table 79. SVR Settings
Device
Package
SVR
(Rev. 2.1)
MPC8358E
PBGA
0x804E_0021
MPC8358
PBGA
0x804F_0021
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