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| 型號(hào)： | MPC8377EWLANA |
| 廠商： | Freescale Semiconductor |
| 文件頁(yè)數(shù)： | 31/127頁(yè) |
| 文件大小： | 0K |
| 描述： | ACCESS POINT/ROUTER MPC8377 |
| 標(biāo)準(zhǔn)包裝： | 1 |
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MPC8377E PowerQUICC II Pro Processor Hardware Specifications, Rev. 8
126
Freescale Semiconductor
2
10/2009
In Table 3, “Recommended Operating Conditions,” added “Operating temperature range” values.
In Table 5, “Power Dissipation 1,” corrected maximal application for 800/400 MHz to 4.3 W.
In Table 11, removed overbar from CFG_CLKIN_DIV.
and DDR2 to 600 and 400
μA, respectively. Also, updated Note 1 and added Note 2.
In Table 20, “DDR1 and DDR2 SDRAM Input AC Timing Specifications,” column headings renamed to
“Min” and “Max”. Footnote 2 updated to state “T is the MCK clock period”.
DDR2 SDRAM Output AC Timing Specifications,” clarified that the frequency parameters are data rates.
Specifications,” corrected titles from “Transmitter” to “Receiver”.
In Table 72, “TePBGA II Pinout Listing,” removed pin THERM0; it is now Reserved. Also added 1.05 V
to VDD pin.
In Table 74, “Operating Frequencies for TePBGA II,” corrected “DDR2 memory bus frequency (MCK)”
range to 125–200.
In Table 79, “e300 Core PLL Configuration,” added 3.5:1 and 4:1 core_clk: csb_clk ratio options.
In Table 80, “Example Clock Frequency Combinations,” updated column heading to “DDR data rate” .
In Section 20.2, “SPI AC Timing Specifications,” corrected tNIKHOX and tNEKHOX to tNIKHOV and tNEKHOV,
respectively.
1
02/2009
In Table 3, “Recommended Operating Conditions,” added two new rows for 800 MHz, and created two
rows for SerDes. In addition, changed 666 to 667 MHz.
In Table 5, “Power Dissipation 1,” added Notes 4 and 5. In addition, changed 666 to 667 MHz.
footnote to references to MVREF, MDQ, and MDQS, referencing AN3665,
MPC837xE Design Checklist.
In Table 72, “TePBGA II Pinout Listing,” added footnote to USBDR_STP_SUSPEND and modified
In Table 74, “Operating Frequencies for TePBGA II,” changed 667 to 800 MHz for
core_clk.
In Table 80, “Example Clock Frequency Combinations,” added 800 MHz cells for e300 core.
Updated part numbering information in AF column in Table 84, “Part Numbering Nomenclature.” In
addition, modified extended temperature information in notes 1 and 4.
In Table 85, “Available Parts (Core/DDR Data Rate),” added new row for 800/400 MHz.
0
12/2008 Initial public release.
Table 87. Document Revision History (continued)
Revision
Date
Substantive Change(s)
相關(guān)PDF資料 |
PDF描述 |
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| 76250ENC | XFRMR MAX250 EN60950 APPROVED |
| DR-TRC105-434-EV | BOARD EVALUATION 434MHZ RFM RFIC |
| DR-TRC105-403-EV | BOARD EVALUATION 403MHZ RFM RFIC |
| DR-TRC105-390-EV | BOARD EVALUATION 390MHZ RFM RFIC |
| 3336-01 | EVAL KIT FOR PE3336 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8377EWLANB | 功能描述:WiFi/802.11模塊 KIT RoHS:否 制造商:Taiyo Yuden 支持協(xié)議:802.11 b/g/n 頻帶: 數(shù)據(jù)速率:150 Mbps 接口類(lèi)型:SDIO 傳輸功率（最大）: 天線連接器類(lèi)型: 工作電源電壓:3.4 V to 5.5 V 傳輸供電電流: 接收供電電流: 最大工作溫度:+ 80 C 尺寸:35 mm x 15 mm x 2.9 mm |
| MPC8377EZQAFDA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8377EZQAFFA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8377EZQAFGA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8377EZQAGDA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
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