參數(shù)資料
型號: MPC8560VTAQFC
廠商: Freescale Semiconductor
文件頁數(shù): 92/108頁
文件大?。?/td> 0K
描述: MPU POWERQUICC III 783FCPBGA
標準包裝: 36
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 1.0GHz
電壓: 1.3V
安裝類型: 表面貼裝
封裝/外殼: 784-BBGA,F(xiàn)CBGA
供應商設備封裝: 783-FCPBGA(29x29)
包裝: 托盤
MPC8560 Integrated Processor Hardware Specifications, Rev. 4.2
84
Freescale Semiconductor
Thermal
Alpha Novatech
408-749-7601
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC)
818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Millennium Electronics (MEI)
408-436-8770
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-millennium.com
Tyco Electronics
800-522-6752
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. Several
heat sinks offered by Aavid Thermalloy, Alpha Novatech, IERC, Chip Coolers, Millennium Electronics,
and Wakefield Engineering offer different heat sink-to-ambient thermal resistances, that will allow the
MPC8560 to function in various environments.
16.2.1 Recommended Thermal Model
For system thermal modeling, the MPC8560 thermal model is shown in Figure 52. Five cuboids are used
to represent this device. To simplify the model, the solder balls and substrate are modeled as a single block
29x29x1.47 mm with the conductivity adjusted accordingly. For modeling, the planar dimensions of the
die are rounded to the nearest mm, so the die is modeled as 10x12 mm at a thickness of 0.76 mm. The
bump/underfill layer is modeled as a collapsed resistance between the die and substrate assuming a
conductivity of 0.6 in-plane and 1.9 W/mK in the thickness dimension of 0.76 mm. The lid attach
adhesive is also modeled as a collapsed resistance with dimensions of 10x12x0.050 mm and the
conductivity of 1 W/mK. The nickel plated copper lid is modeled as 12x14x1 mm. Note that the die and
lid are not centered on the substrate; there is a 1.5 mm offset documented in the case outline drawing in
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