參數(shù)資料
型號(hào): MPC8568EVTAUJJ
廠商: Freescale Semiconductor
文件頁數(shù): 133/139頁
文件大?。?/td> 0K
描述: MPU POWERQUICC III 1023-PBGA
標(biāo)準(zhǔn)包裝: 24
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 1.333GHz
電壓: 1.1V
安裝類型: 表面貼裝
封裝/外殼: 1023-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 1023-FCPBGA(33x33)
包裝: 托盤
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
93
TDM/SI
19.2
TDM/SI AC Timing Specifications
Table 72 provides the TDM/SI input and output AC timing specifications.
Figure 60 provides the AC test load for the TDM/SI.
Figure 60. TDM/SI AC Test Load
Figure 61 represents the AC timing from Table 72. Note that although the specifications generally
reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge is the
active edge.
Input low voltage
VIL
—-0.3
0.8
V
Input current
IIN
0 V
≤ VIN ≤ OVDD
± 10
μA
Table 72. TDM/SI AC Timing Specifications 1
Characteristic
Symbol 2
Min
Max
Unit
TDM/SI outputs—External clock delay
tSEKHOV
211
ns
TDM/SI outputs—External clock High Impedance
tSEKHOX
210
ns
TDM/SI inputs—External clock input setup time
tSEIVKH
5—
ns
TDM/SI inputs—External clock input hold time
tSEIXKH
2—
ns
Notes:
1. Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal.
Timings are measured at the pin.
2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,
tSEKHOX symbolizes the TDM/SI outputs external timing (SE) for the time tTDM/SI memory clock reference (K) goes
from the high state (H) until outputs (O) are invalid (X).
Table 71. TDM/SI DC Electrical Characteristics (continued)
Characteristic
Symbol
Condition
Min
Max
Unit
Output
Z0 = 50 Ω
OVDD/2
RL = 50 Ω
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