參數(shù)資料
型號: MSC8156SVT1000B
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 數(shù)字信號處理
英文描述: 0-BIT, OTHER DSP, PBGA783
封裝: 29 X 29 MM, LEAD FREE, PLASTIC, FCBGA-783
文件頁數(shù): 18/68頁
文件大?。?/td> 910K
代理商: MSC8156SVT1000B
Electrical Characteristics
MSC8156 Six-Core Digital Signal Processor Data Sheet, Rev. 3
Freescale Semiconductor
25
Table 4 describes thermal characteristics of the MSC8156 for the FC-PBGA packages.
2.4
CLKIN Requirements
Table 5 summarizes the required characteristics for the CLKIN signal.
This section describes the DC electrical characteristics for the MSC8156.
2.5.1
DDR SDRAM DC Electrical Characteristics
This section describes the DC electrical specifications for the DDR SDRAM interface of the MSC8156.
Note:
DDR2 SDRAM uses VDDDDR(typ) = 1.8 V and DDR3 SDRAM uses VDDDDR(typ) = 1.5 V.
Table 4. Thermal Characteristics for the MSC8156
Characteristic
Symbol
FC-PBGA
29
× 29 mm2
Unit
Natural
Convection
200 ft/min
(1 m/s) airflow
Junction-to-ambient1, 2
RθJA
18
12
°C/W
Junction-to-ambient, four-layer board1, 2
RθJA
13
9
°C/W
Junction-to-board (bottom)3
RθJB
5
°C/W
Junction-to-case4
RθJC
0.6
°C/W
Notes:
1.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2.
Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESDC51-6. Thermal test board meets JEDEC
specification for the specified package.
3.
Junction-to-board thermal resistance determined per JEDEC JESD 51-8. Thermal test board meets JEDEC specification for
the specified package.
4.
Junction-to-case at the top of the package determined using MIL- STD-883 Method 1012.1. The cold plate temperature is used
for the case temperature. Reported value includes the thermal resistance of the interface layer
Table 5. CLKIN Requirements
Parameter/Condition1
Symbol
Min
Typ
Max
Unit
Notes
CLKIN duty cycle
40
60
%
2
CLKIN slew rate
1
4
V/ns
3
CLKIN peak period jitter
±150
ps
CLKIN jitter phase noise at –56 dBc
500
KHz
4
AC input swing limits
ΔVAC
1.5
V
Input capacitance
CIN
——
15
pf
Notes:
1.
For clock frequencies, see the Clock chapter in the MSC8156 Reference Manual.
2.
Measured at the rising edge and/or the falling edge at VDDIO/2.
3.
Slew rate as measured from ±20% to 80% of voltage swing at clock input.
4.
Phase noise is calculated as FFT of TIE jitter.
相關(guān)PDF資料
PDF描述
MSC8254TVT800B 0-BIT, OTHER DSP, PBGA783
MSC8254SVT800B 0-BIT, OTHER DSP, PBGA783
MSC8254TVT1000B 0-BIT, OTHER DSP, PBGA783
MSC8256SVT800B 0-BIT, OTHER DSP, PBGA783
MSC8256TVT800B 0-BIT, OTHER DSP, PBGA783
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MSC8156SVT1200B 制造商:Freescale Semiconductor 功能描述:DSP, STARCORE, 6-CORES - Bulk
MSC8156TAG1000B 制造商:Freescale Semiconductor 功能描述:STARCORE DSP, 6X 1GHZ SC3850 CORES, MAPLE-B ACCELERATOR, DDR - Trays 制造商:Freescale Semiconductor 功能描述:IC DSP 6X 1GHZ SC3850 783FCBGA
MSC8156TVT1000A 制造商:Freescale Semiconductor 功能描述:DSP, STARCORE, 6-CORES - Bulk
MSC8156TVT1000B 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC DSP StarCore 6-cores RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
MSC8156TVT1200B 制造商:Freescale Semiconductor 功能描述:DSP, STARCORE, 6-CORES - Bulk