PRODUCTPREVIEW
MSP430BT5190
SLAS703 – APRIL 2010
www.ti.com
Crystal Oscillator, XT1, High-Frequency Mode
(continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
Integrated effective load
CL,eff
XTS = 1
1
pF
capacitance, HF mode(5) (6)
XTS = 1, Measured at ACLK,
Duty cycle
HF mode
40
50
60
%
fXT1,HF2 = 20 MHz
Oscillator fault frequency,
fFault,HF
XTS = 1(8)
30
300
kHz
HF mode(7)
(5)
Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
(6)
Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
(7)
Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies in between might set the flag.
(8)
Measured with logic-level input frequency but also applies to operation with crystals.
Crystal Oscillator, XT2
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
(1) (2)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
fOSC = 4 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 0,
200
TA = 25°C
fOSC = 12 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 1,
260
TA = 25°C
XT2 oscillator crystal current
IDVCC.XT2
3.0 V
A
consumption
fOSC = 20 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 2,
325
TA = 25°C
fOSC = 32 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 3,
450
TA = 25°C
XT2 oscillator crystal frequency,
fXT2,HF0
XT2DRIVEx = 0, XT2BYPASS = 0(3)
4
8
MHz
mode 0
XT2 oscillator crystal frequency,
fXT2,HF1
XT2DRIVEx = 1, XT2BYPASS = 0(3)
8
16
MHz
mode 1
XT2 oscillator crystal frequency,
fXT2,HF2
XT2DRIVEx = 2, XT2BYPASS = 0(3)
16
24
MHz
mode 2
XT2 oscillator crystal frequency,
fXT2,HF3
XT2DRIVEx = 3, XT2BYPASS = 0(3)
24
32
MHz
mode 3
XT2 oscillator logic-level
fXT2,HF,SW
square-wave input frequency,
XT2BYPASS = 1(4) (3)
1.5
32
MHz
bypass mode
(1)
Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
(2)
To improve EMI on the XT2 oscillator the following guidelines should be observed.
(a) Keep the traces between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XT2IN and XT2OUT.
(d) Avoid running PCB traces underneath or adjacent to the XT2IN and XT2OUT pins.
(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XT2IN and XT2OUT pins.
(f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
(3)
This represents the maximum frequency that can be input to the device externally. Maximum frequency achievable on the device
operation is based on the frequencies present on ACLK, MCLK, and SMCLK cannot be exceed for a given range of operation.
(4)
When XT2BYPASS is set, the XT2 circuit is automatically powered down. Input signal is a digital square wave with parametrics defined
in the Schmitt-trigger Inputs section of this datasheet.
48
Copyright 2010, Texas Instruments Incorporated