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參數(shù)資料
| 型號(hào)： | MT28C256564W18SBT-F605P85BBWT |
| 元件分類： | 存儲(chǔ)器 |
| 英文描述： | SPECIALTY MEMORY CIRCUIT, PBGA88 |
| 封裝： | LEAD FREE, FBGA-88 |
| 文件頁數(shù)： | 6/15頁 |
| 文件大?。?/td> | 218K |
| 代理商： | MT28C256564W18SBT-F605P85BBWT |
256Mb MULTIBANK BURST FLASH
32Mb/64Mb ASYNC/PAGE CellularRAM COMBO
PRELIMINARY
09005aef80bcd58d
Micron Technology, Inc., reserves the right to change products or specifications without notice..
MT28C256564W18S.fm - Rev. D Pub 2/04 EN
14
2004 Micron Technology, Inc All rights reserved.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Micron, the M logo, and the Micron logo are trademarks and/or service marks of Micron Technology, Inc.
CellularRAM is a trademark of Micron Technology, Inc., inside the U.S. and a trademark of Infineon Technologies outside the U.S.
All other trademarks are the property of their respective owners.
Figure 5: 88-Ball FBGA
NOTE:
1. All dimensions in millimeters.
Data Sheet Designation
Preliminary: This data sheet contains initial characterization limits that are subject to change upon full
characterization of production devices.
For additional documentation concerning Flash and CellularRAM features, functional descriptions, program-
ming, and timing, please refer to the table below.
BALL A1 ID
BALL A1
BALL A8
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
1.40 MAX
0.25 ±0.05
SOLDER BALL MATERIAL:
62% Sn, 36% Pb, 2% Ag
SOLDER BALL PAD: 0.30mm SOLDER MASK DEFINED
5.60
9.00 ±0.10
2.80 ±0.05
4.50 ±0.05
8.80
4.40 ±0.05
6.00 ±0.05
12.00 ±0.10
88X
0.35
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE
PRE-REFLOW DIAMETER
IS 0.35
CL
SEATING PLANE
1.025 ±0.075
0.10 C
C
0.80
TYP
0.80
TYP
0.10
(4X)
DEVICE
PART NUMBER
LINK
Flash
MT28F1284W18
CellularRAM
MT45W2MW16PFA, MT45W4MW16PFA
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