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參數(shù)資料
| 型號： | MT55L512V18PF-6 |
| 廠商： | CYPRESS SEMICONDUCTOR CORP |
| 元件分類： | SRAM |
| 英文描述： | 512K X 18 ZBT SRAM, 3.5 ns, PBGA165 |
| 封裝： | 13 X 15 MM, FBGA-165 |
| 文件頁數(shù)： | 17/25頁 |
| 文件大?。?/td> | 304K |
| 代理商： | MT55L512V18PF-6 |
24
8Mb: 512K x 18, 256K x 32/36 Pipelined ZBT SRAM
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT55L512L18P_C.p65 – Rev. 2/02
2002, Micron Technology, Inc.
8Mb: 512K x 18, 256K x 32/36
PIPELINED ZBT SRAM
165-PIN FBGA
NOTE: 1. All dimensions in millimeters MAX or typical where noted.
MIN
10.00
14.00
15.00 ±0.10
1.00
TYP
1.00
TYP
5.00 ±0.05
13.00 ±0.10
PIN A1 ID
BALL A1
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
6.50 ±0.05
7.00 ±0.05
7.50 ±0.05
1.20 MAX
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb
SOLDER BALL PAD: .33mm
SOLDER BALL DIAMETER REFERS
TO POST REFLOW CONDITION. THE
PRE-REFLOW DIAMETER IS 0.40
SEATING PLANE
0.85 ±0.075
0.12 C
C
165X 0.45
BALL A11
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micronsemi.com, Customer Comment Line: 800-932-4992
Micron is a registered trademark of Micron Technology, Inc.
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc.,
and the architecture is supported by Micron Technology, Inc., and Motorola Inc.
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| MT55L512Y32PF-10 | 制造商:Micron Technology Inc 功能描述: |
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