參數(shù)資料
型號(hào)： OM11079
廠商： NXP Semiconductors
文件頁(yè)數(shù)： 34/57頁(yè)
文件大?。?/td> 0K
描述： MODULE DIMM LPC3250 ARM9
標(biāo)準(zhǔn)包裝： 1
附件類型： 模塊卡
適用于相關(guān)產(chǎn)品： ARM-57TS-LPC3250
相關(guān)產(chǎn)品： 622-1033-ND - KIT LCD TOUCH 5.7" FOR LPC2478
568-4743-ND - KIT LCD TOUCH 5.7" FOR LPC3250
568-4741-ND - KIT LCD TOUCH 5.7" FOR LPC2478
622-1030-ND - KIT LCD TOUCH 5.7" FOR LPC3250
622-1028-ND - KIT LCD TOUCH 5.7" FOR LPC2478
其它名稱： 568-4744
LPC3220_30_40_50
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 20 October 2011
4 of 79
NXP Semiconductors
LPC3220/30/40/50
16/32-bit ARM microcontrollers
4.
Ordering information
[1]
F =
40 C to +85 C temperature range. Note that Revision “A” parts with and without the /01 suffix are identical. For example,
LPC3220FET296 Revision “A” is identical to LPC3220FET296/01 Revision “A”.
[2]
Available starting with Revision “A”.
4.1 Ordering options
Table 1.
Ordering information
Type number[1]
Package
Name
Description
Version
LPC3220FET296/01[2]
TFBGA296
plastic thin fine-pitch ball grid array package; 296 balls SOT1048-1
LPC3230FET296/01[2]
TFBGA296
plastic thin fine-pitch ball grid array package; 296 balls SOT1048-1
LPC3240FET296/01[2]
TFBGA296
plastic thin fine-pitch ball grid array package; 296 balls SOT1048-1
LPC3250FET296/01[2]
TFBGA296
plastic thin fine-pitch ball grid array package; 296 balls SOT1048-1
Table 2.
Part options
Type number
SRAM (kB)
10/100 Ethernet
LCD
controller
Temperature range (
C)
Package
LPC3220FET296/01
128
0
40 to +85
TFBGA296
LPC3230FET296/01
256
0
1
40 to +85
TFBGA296
LPC3240FET296/01
256
1
0
40 to +85
TFBGA296
LPC3250FET296/01
256
1
40 to +85
TFBGA296
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
OM11079,598 功能描述:開(kāi)發(fā)板和工具包 - ARM NXP LPC3250 SODIMM for IRD2.0 RoHS:否 制造商:Arduino 產(chǎn)品:Development Boards 工具用于評(píng)估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口類型:DAC, ICSP, JTAG, UART, USB 工作電源電壓:3.3 V
OM11080,598 制造商:NXP Semiconductors 功能描述:LPC1768 CORTEX-M3 3.2" 2X40 LCD DISPLAY KIT, ARM CORTEX-M3 M - Boxed Product (Development Kits)
OM11082,598 功能描述:開(kāi)發(fā)板和工具包 - ARM NXP LPC3250 IRD2.0-5.7"LCD/Lnx RoHS:否 制造商:Arduino 產(chǎn)品:Development Boards 工具用于評(píng)估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口類型:DAC, ICSP, JTAG, UART, USB 工作電源電壓:3.3 V
OM11083 制造商:NXP Semiconductors 功能描述:EVAL LPCXPRESSO BASEBOARD 制造商:NXP Semiconductors 功能描述:BASEBOARD, FOR LPCXPRESSO, LPC1XXX 制造商:NXP Semiconductors 功能描述:BASEBOARD, FOR LPCXPRESSO, LPC1XXX; Silicon Manufacturer:NXP; Features:BaseBoard for LPCXpresso/mbed Board with a viariety of interfaces and I/O devices; SVHC:No SVHC (19-Dec-2012) ;RoHS Compliant: Yes
OM11083,598 功能描述:開(kāi)發(fā)板和工具包 - ARM Embedded Artist Base LPCXpresso mbed RoHS:否 制造商:Arduino 產(chǎn)品:Development Boards 工具用于評(píng)估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口類型:DAC, ICSP, JTAG, UART, USB 工作電源電壓:3.3 V
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