參數(shù)資料
型號(hào)： OM11079
廠商： NXP Semiconductors
文件頁(yè)數(shù)： 48/57頁(yè)
文件大?。?/td> 0K
描述： MODULE DIMM LPC3250 ARM9
標(biāo)準(zhǔn)包裝： 1
附件類型： 模塊卡
適用于相關(guān)產(chǎn)品： ARM-57TS-LPC3250
相關(guān)產(chǎn)品： 622-1033-ND - KIT LCD TOUCH 5.7" FOR LPC2478
568-4743-ND - KIT LCD TOUCH 5.7" FOR LPC3250
568-4741-ND - KIT LCD TOUCH 5.7" FOR LPC2478
622-1030-ND - KIT LCD TOUCH 5.7" FOR LPC3250
622-1028-ND - KIT LCD TOUCH 5.7" FOR LPC2478
其它名稱： 568-4744
LPC3220_30_40_50
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 20 October 2011
52 of 79
NXP Semiconductors
LPC3220/30/40/50
16/32-bit ARM microcontrollers
[1]
Typical ratings are not guaranteed. The values listed are at room temperature (25
C), nominal supply voltages.
[2]
Applies to VDD_CORE pins.
[3]
Applies to pins VDD_RTC, VDD_RTCCORE, and VDD_RTCOSC.
[4]
Applies to pins VDD_COREFXD, VDD_OSC, VDD_PLL397, VDD_PLLHCLK, and VDD_PLLUSB.
[5]
Applies when using 1.8 V Mobile DDR or Mobile SDR SDRAM.
[6]
Applies when using 2.5 V DDR memory.
[7]
Applies when using 3.3 V SDR SDRAM and SRAM.
[8]
Specifies current on combined VDD_RTCx during normal chip operation: VDD_RTC, VDD_CORE, VDD_OSC = 1.2 V and
VDD_CORE, VDD_IOx at typical voltage.
[9]
Specifies current on combined VDD_RTCx during backup operation: VDD_RTC, VDD_CORE, VDD_OSC = 1.2 V and all other VDD_x
at 0 V.
[10] Referenced to the applicable VDD for the pin.
[11] Including voltage on outputs in 3-state mode.
[12] The applicable VDD voltage for the pin must be present.
[13] 3-state outputs go into 3-state mode when the applicable VDD voltage for the pin is grounded.
[14] Accounts for 100 mV voltage drop in all supply lines.
[15] Allowed as long as the current limit does not exceed the maximum current allowed by the device.
IIH
HIGH-level input current VI = VDD; no pull-down
1
A
IOZ
OFF-state output current VO = 0 V; VO =VDD;
no pull-up/down
1
A
Ilatch
I/O latch-up current
(1.5V
DD) < VI < (1.5VDD)
100
mA
Table 8.
Static characteristics …continued
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
OM11079,598 功能描述:開發(fā)板和工具包 - ARM NXP LPC3250 SODIMM for IRD2.0 RoHS:否 制造商:Arduino 產(chǎn)品:Development Boards 工具用于評(píng)估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口類型:DAC, ICSP, JTAG, UART, USB 工作電源電壓:3.3 V
OM11080,598 制造商:NXP Semiconductors 功能描述:LPC1768 CORTEX-M3 3.2" 2X40 LCD DISPLAY KIT, ARM CORTEX-M3 M - Boxed Product (Development Kits)
OM11082,598 功能描述:開發(fā)板和工具包 - ARM NXP LPC3250 IRD2.0-5.7"LCD/Lnx RoHS:否 制造商:Arduino 產(chǎn)品:Development Boards 工具用于評(píng)估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口類型:DAC, ICSP, JTAG, UART, USB 工作電源電壓:3.3 V
OM11083 制造商:NXP Semiconductors 功能描述:EVAL LPCXPRESSO BASEBOARD 制造商:NXP Semiconductors 功能描述:BASEBOARD, FOR LPCXPRESSO, LPC1XXX 制造商:NXP Semiconductors 功能描述:BASEBOARD, FOR LPCXPRESSO, LPC1XXX; Silicon Manufacturer:NXP; Features:BaseBoard for LPCXpresso/mbed Board with a viariety of interfaces and I/O devices; SVHC:No SVHC (19-Dec-2012) ;RoHS Compliant: Yes
OM11083,598 功能描述:開發(fā)板和工具包 - ARM Embedded Artist Base LPCXpresso mbed RoHS:否 制造商:Arduino 產(chǎn)品:Development Boards 工具用于評(píng)估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口類型:DAC, ICSP, JTAG, UART, USB 工作電源電壓:3.3 V
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