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參數(shù)資料
| 型號： | OM11079 |
| 廠商： | NXP Semiconductors |
| 文件頁數(shù)： | 50/57頁 |
| 文件大?。?/td> | 0K |
| 描述： | MODULE DIMM LPC3250 ARM9 |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 附件類型： | 模塊卡 |
| 適用于相關(guān)產(chǎn)品： | ARM-57TS-LPC3250 |
| 相關(guān)產(chǎn)品： | 622-1033-ND - KIT LCD TOUCH 5.7" FOR LPC2478 568-4743-ND - KIT LCD TOUCH 5.7" FOR LPC3250 568-4741-ND - KIT LCD TOUCH 5.7" FOR LPC2478 622-1030-ND - KIT LCD TOUCH 5.7" FOR LPC3250 622-1028-ND - KIT LCD TOUCH 5.7" FOR LPC2478 |
| 其它名稱： | 568-4744 |
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LPC3220_30_40_50
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 20 October 2011
54 of 79
NXP Semiconductors
LPC3220/30/40/50
16/32-bit ARM microcontrollers
10.4 Power consumption in Run mode
Power consumption is shown in Figure 5 for WinCE applications running under typical
conditions from SDRAM. MMU and I-cache/D-cache are enabled. The VFP is turned on
but not used. I2S-interface (channel 1), LCD, SLC NAND controller, I2C1-bus, SD card,
touchscreen ADC, and UART 3 are turned on. All other peripherals are turned off.
The AHB clock HCLK is identical to the core clock for frequencies up to 133 MHz, which is
the maximum allowed HCLK frequency. For higher core frequencies, the HCLK PLL
output must be divided by 2 to obtain an HCLK frequency lower than or equal to 133 MHz
resulting in correspondingly lower power consumption by the AHB peripherals.
Conditions: Tamb =25 C; VDD_CORE = 1.2 V for core frequencies 208 MHz;
VDD_CORE = 1.35 V for core frequencies > 208 MHz; VDD(IO) = 1.8 V.
(1) WinCE running from SDRAM; playing wmv file at 20 frames/s, 32 kHz mono.
(2) WinCE running from SDRAM; playing mp3 file at 128 kbit/s, stereo.
(3) WinCE running from SDRAM; no application running.
Fig 5.
Core current versus core frequency for WinCE applications
core frequency (MHz)
40
280
200
120
002aae762
80
40
120
160
IDD(run)
(mA)
0
(1)
(2)
(3)
HCLK = 133 MHz
HCLK = 72 MHz
VDD_CORE =
1.2 V
VDD_CORE =
1.35 V
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| OM11079,598 | 功能描述:開發(fā)板和工具包 - ARM NXP LPC3250 SODIMM for IRD2.0 RoHS:否 制造商:Arduino 產(chǎn)品:Development Boards 工具用于評估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口類型:DAC, ICSP, JTAG, UART, USB 工作電源電壓:3.3 V |
| OM11080,598 | 制造商:NXP Semiconductors 功能描述:LPC1768 CORTEX-M3 3.2" 2X40 LCD DISPLAY KIT, ARM CORTEX-M3 M - Boxed Product (Development Kits) |
| OM11082,598 | 功能描述:開發(fā)板和工具包 - ARM NXP LPC3250 IRD2.0-5.7"LCD/Lnx RoHS:否 制造商:Arduino 產(chǎn)品:Development Boards 工具用于評估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口類型:DAC, ICSP, JTAG, UART, USB 工作電源電壓:3.3 V |
| OM11083 | 制造商:NXP Semiconductors 功能描述:EVAL LPCXPRESSO BASEBOARD 制造商:NXP Semiconductors 功能描述:BASEBOARD, FOR LPCXPRESSO, LPC1XXX 制造商:NXP Semiconductors 功能描述:BASEBOARD, FOR LPCXPRESSO, LPC1XXX; Silicon Manufacturer:NXP; Features:BaseBoard for LPCXpresso/mbed Board with a viariety of interfaces and I/O devices; SVHC:No SVHC (19-Dec-2012) ;RoHS Compliant: Yes |
| OM11083,598 | 功能描述:開發(fā)板和工具包 - ARM Embedded Artist Base LPCXpresso mbed RoHS:否 制造商:Arduino 產(chǎn)品:Development Boards 工具用于評估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口類型:DAC, ICSP, JTAG, UART, USB 工作電源電壓:3.3 V |
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