參數(shù)資料
型號(hào): OM13013,598
廠商: NXP Semiconductors
文件頁(yè)數(shù): 49/61頁(yè)
文件大?。?/td> 0K
描述: BOARD DEMO IAR LPC1227 JLINKLITE
標(biāo)準(zhǔn)包裝: 1
類(lèi)型: MCU
適用于相關(guān)產(chǎn)品: LPC1227
所含物品:
其它名稱(chēng): 568-6885
LPC122X
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 26 August 2011
53 of 61
NXP Semiconductors
LPC122x
32-bit ARM Cortex-M0 microcontroller
Fig 26. Package outline SOT313-2 (LQFP48)
UNIT
A
max.
A1
A2
A3
bp
cE(1)
eHE
LLp
Z
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
1.6
0.20
0.05
1.45
1.35
0.25
0.27
0.17
0.18
0.12
7.1
6.9
0.5
9.15
8.85
0.95
0.55
7
0
o
0.12
0.1
0.2
1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT313-2
MS-026
136E05
00-01-19
03-02-25
D(1)
(1)
7.1
6.9
HD
9.15
8.85
E
Z
0.95
0.55
D
bp
e
E
B
12
D
H
b p
E
H
v M B
D
ZD
A
Z E
e
v M A
1
48
37
36
25
24
13
θ
A1
A
L p
detail X
L
(A )
3
A2
X
y
c
w M
0
2.5
5 mm
scale
pin 1 index
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
SOT313-2
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