參數(shù)資料
型號(hào)： S71GL064A08BAW0F3
廠商： SPANSION LLC
元件分類： 存儲(chǔ)器
英文描述： Stacked Multi-Chip Product (MCP) Flash Memory and RAM
中文描述： SPECIALTY MEMORY CIRCUIT, PBGA56
封裝： 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
文件頁數(shù)： 24/134頁
文件大?。?/td> 2383K
代理商： S71GL064A08BAW0F3
10
S71GL064A based MCPs
S71GL064A_00_A2 February 8, 2005
Advance
Info rmation
Ordering Information
The order number is formed by a valid combinations of the following:
Table 1:
S71GL
064
A
A0
BA
W
9
Z
0
PACKING TYPE
0= Tray
2
= 7” Tape and Reel
3
= 13” Tape and Reel
MODEL NUMBER
See the Valid Combinations table.
PACKAGE MODIFIER
0
= 7 x 9 mm, 1.2 mm height, 56 balls (TLC056)
TEMPERATURE RANGE
W= Wireless (-25
°C to +85°C)
I
= Industrial (-40
°C to +85°C)
PACKAGE TYPE
BA
= Fine-pitch BGA Lead (Pb)-free compliant package
BF
= Fine-pitch BGA Lead (Pb)-free package
pSRAM / SRAM DENSITY
0A
= 16 Mb SRAM
A0
= 16 Mb pSRAM
80
= 8 Mb pSRAM
08
= 8 Mb SRAM
PROCESS TECHNOLOGY
A
= 200 nm, MirrorBit Technology
FLASH DENSITY
064
= 64Mb
PRODUCT FAMILY
S71GL Multi-chip Product (MCP)
3.0-volt Page Mode Flash Memory and RAM
相關(guān)PDF資料
PDF描述
S71GL064A08BFI0B2 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFI0B3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFI0F3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFW0B2 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFW0B3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S71GL064A08BFI0B0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFI0B2 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFI0B3 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFI0F0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFI0F2 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
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