參數(shù)資料
型號： S71GL064A08BAW0F3
廠商： SPANSION LLC
元件分類： 存儲器
英文描述： Stacked Multi-Chip Product (MCP) Flash Memory and RAM
中文描述： SPECIALTY MEMORY CIRCUIT, PBGA56
封裝： 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
文件頁數(shù)： 68/134頁
文件大?。?/td> 2383K
代理商： S71GL064A08BAW0F3
February 8, 2005 S71GL064A_00_A2
S71GL064A based MCPs
37
Advance
Informatio n
Table 6. CFI Query Identification String
Table 7. System Interface String
Note: CFI data related to VCC and time-outs may differ from actual VCC and time-outs of the product. Please consult the Ordering
Information tables to obtain the VCC range for particular part numbers. Please contact the Erase and Programming Performance table for
typical timeout specifications.
Addresses (x16)
Addresses (x8)
Data
Description
10h
11h
12h
20h
22h
24h
0051h
0052h
0059h
Query Unique ASCII string “QRY”
13h
14h
26h
28h
0002h
0000h
Primary OEM Command Set
15h
16h
2Ah
2Ch
0040h
0000h
Address for Primary Extended Table
17h
18h
2Eh
30h
0000h
Alternate OEM Command Set (00h = none exists)
19h
1Ah
32h
34h
0000h
Address for Alternate OEM Extended Table (00h = none exists)
Addresses (x16)
Addresses (x8)
Data
Description
1Bh
36h
0027h
VCC Min. (write/erase)
D7–D4: volt, D3–D0: 100 millivolt
1Ch
38h
0036h
VCC Max. (write/erase)
D7–D4: volt, D3–D0: 100 millivolt
1Dh
3Ah
0000h
VPP Min. voltage (00h = no VPP pin present)
1Eh
3Ch
0000h
VPP Max. voltage (00h = no VPP pin present)
1Fh
3Eh
0007h
Reserved for future use
20h
40h
0007h
Typical timeout for Min. size buffer write 2N
s (00h = not supported)
21h
42h
000Ah
Typical timeout per individual block erase 2N ms
22h
44h
0000h
Typical timeout for full chip erase 2N ms (00h = not supported)
23h
46h
0001h
Reserved for future use
24h
48h
0005h
Max. timeout for buffer write 2N times typical
25h
4Ah
0004h
Max. timeout per individual block erase 2N times typical
26h
4Ch
0000h
Max. timeout for full chip erase 2N times typical (00h = not supported)
相關(guān)PDF資料
PDF描述
S71GL064A08BFI0B2 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFI0B3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFI0F3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFW0B2 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFW0B3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S71GL064A08BFI0B0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFI0B2 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFI0B3 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFI0F0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFI0F2 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

我的聯(lián)系方式

*
*
*