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參數(shù)資料
| 型號： | SCM69C233 |
| 廠商： | Motorola, Inc. |
| 英文描述： | 4K x 64 Content Addressable Memory(4K x 64內(nèi)容可尋址存儲器) |
| 中文描述： | 4K的× 64內(nèi)容可尋址存儲器（4K的× 64內(nèi)容可尋址存儲器） |
| 文件頁數(shù)： | 21/22頁 |
| 文件大?。?/td> | 167K |
| 代理商： | SCM69C233 |
MCM69C233
SCM69C233
21
MOTOROLA FAST SRAM
TQ PACKAGE
TQFP
CASE 983A–01
PACKAGE DIMENSIONS
DIM
A
A1
A2
b
b1
c
c1
D
D1
MIN
–––
0.05
1.35
0.22
0.22
0.09
0.09
22.00 BSC
20.00 BSC
MAX
1.60
0.15
1.45
0.38
0.33
0.20
0.16
MILLIMETERS
E
E1
e
L
L1
L2
S
R1
R2
16.00 BSC
14.00 BSC
0.65 BSC
0.45
1.00 REF
0.50 REF
0.20
0.08
0.08
0
0
11
11
0.75
–––
–––
0.20
7
–––
13
13
1
2
3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M 1982.
2. DATUMPLANE –H– IS LOCATED AT BOTTOMOF LEAD
AND IS COINCIDENT WITH THE LEAD WHERE THE
LEAD EXITS THE PLASTIC BODY AT THE BOTTOMOF
THE PARTING LINE.
3. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT
DATUMPLANE –H–.
4. DIMENSIONS D AND E TO BE DETERMINED AT
SEATING PLANE –C–.
5. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS D1 AND B1 DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUMPLANE –H–.
6. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE b DIMENSION TO EXCEED 0.45 (0.018).
A–B
0.20 (0.008) H
e
D
A–B
0.20 (0.008) C
D
A–B
0.20 (0.008) C
D
0.10 (0.004) C
0.25 (0.010)
S
0.05 (0.002)
S
A–B
M
0.13 (0.005)
D
S
C
e/2
D/2
E
E1
D1
D
D1/2
E1/2
E/2
4X
2X 30 TIPS
2X 20 TIPS
–D–
–B–
–A–
–C–
SEATING
–H–
1
3
2
100
81
80
51
50
31
30
1
PLATING
SECTION B–B
c1
c
b
b1
éééé
éééé
BASE
METAL
A
VIEW AB
S
VIEW AB
A2
A1
R1
L2
L
L1
R2
GAGE PLANE
–X–
X=A, B, OR D
VIEW Y
B
B
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