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參數(shù)資料
| 型號： | TDA8752BH |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Triple high-speed Analog-to-Digital Converter 110 Msps ADC |
| 中文描述： | 三高速模擬數(shù)字轉(zhuǎn)換器110 MSPS的ADC的 |
| 文件頁數(shù)： | 33/36頁 |
| 文件大?。?/td> | 154K |
| 代理商： | TDA8752BH |
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2000 Jan 10
33
Philips Semiconductors
Preliminary specification
Triple high-speed Analog-to-Digital
Converter 110 Msps (ADC)
TDA8752B
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
相關(guān)PDF資料 |
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|---|---|
| TDA8753 | YUV 8-bit analog-to-digital interface |
| TDA8753A | YUV 8-bit analog-to-digital interface |
| TDA8758 | YC8-bit Video Low-Power Analog-to-Digital Interface(YC8位視頻低功耗模數(shù)接口) |
| TDA8758G | YC 8-bit low-power analog-to-digital video interface |
| TDA8763AM | 10-bit high-speed low-power ADC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TDA8752BH/8 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Triple high-speed Analog-to-Digital Converter 110 Msps ADC |
| TDA8752H | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Triple high speed Analog-to-Digital Converter ADC |
| TDA8752H/6 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Triple high speed Analog-to-Digital Converter ADC |
| TDA8752H/8 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Triple high speed Analog-to-Digital Converter ADC |
| TDA8753 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:YUV 8-bit analog-to-digital interface |
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