參數(shù)資料
型號: UCD9501
廠商: Texas Instruments, Inc.
元件分類: 數(shù)字信號處理
英文描述: Digital Signal Processors
中文描述: 數(shù)字信號處理器
文件頁數(shù): 129/134頁
文件大?。?/td> 1133K
代理商: UCD9501
Orderable Device
Status
(1)
Package
Type
R
BGA
BGA
LQFP
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TMS320F2806GGMA
TMS320F2806GGMS
TMS320F2806PZA
ACTIVE
ACTIVE
ACTIVE
GGM
GGM
PZ
100
100
100
184
184
1
TBD
TBD
SNPB
SNPB
Level-3-220C-168HR
Level-3-220C-168HR
Level-2-260C-1YR
Green (RoHS &
no Sb/Br)
TBD
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
CU NIPDAU
TMS320F2806PZQ
TMS320F2806PZS
ACTIVE
ACTIVE
LQFP
LQFP
PZ
PZ
100
100
90
90
Call TI
CU NIPDAU
Call TI
Level-2-260C-1YR
TMS320F2806ZGMA
ACTIVE
BGA MI
CROSTA
R
BGA MI
CROSTA
R
BGA
BGA
LQFP
ZGM
100
184
Call TI
Level-3-260C-168HR
TMS320F2806ZGMS
ACTIVE
ZGM
100
184
TBD
Call TI
Call TI
TMS320F2808GGMA
TMS320F2808GGMS
TMS320F2808PZA
ACTIVE
ACTIVE
ACTIVE
GGM
GGM
PZ
100
100
100
184
184
90
TBD
TBD
SNPB
SNPB
Level-3-220C-168HR
Level-3-220C-168HR
Level-2-260C-1YR
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
CU NIPDAU
TMS320F2808PZQ
ACTIVE
LQFP
PZ
100
90
CU NIPDAU
Level-2-260C-1YR
TMS320F2808PZS
ACTIVE
LQFP
PZ
100
90
CU NIPDAU
Level-2-260C-1YR
TMS320F2808ZGMA
ACTIVE
BGA MI
CROSTA
R
BGA MI
CROSTA
R
LQFP
LQFP
ZGM
100
184
Call TI
Level-3-260C-168HR
TMS320F2808ZGMS
ACTIVE
ZGM
100
184
Green (RoHS &
no Sb/Br)
Call TI
Level-3-260C-168HR
UCD9501PZA
UCD9501PZS
ACTIVE
ACTIVE
PZ
PZ
100
100
1
1
TBD
TBD
Call TI
Call TI
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
PACKAGE OPTION ADDENDUM
www.ti.com
6-Mar-2006
Addendum-Page 2
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