
User’s Manual U15862EJ3V0UD
745
CHAPTER 28 RECOMMENDED SOLDERING CONDITIONS
The V850ES/KF1, V850ES/KG1, and V850ES/KJ1 should be soldered and mounted under the following
recommended conditions. For details of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
Table 28-1. Surface Mounting Type Soldering Conditions (1/3)
(1)
μ
PD703208GK-xxx-9EU:
μ
PD703208YGK-xxx-9EU: 80-pin plastic TQFP (fine pitch) (12
×
12)
μ
PD703209GK-xxx-9EU:
80-pin plastic TQFP (fine pitch) (12
×
12)
μ
PD703209YGK-xxx-9EU: 80-pin plastic TQFP (fine pitch) (12
×
12)
μ
PD703210GK-xxx-9EU:
80-pin plastic TQFP (fine pitch) (12
×
12)
μ
PD703210YGK-xxx-9EU: 80-pin plastic TQFP (fine pitch) (12
×
12)
μ
PD70F3210GK-9EU:
80-pin plastic TQFP (fine pitch) (12
×
12)
μ
PD70F3210YGK-9EU:
80-pin plastic TQFP (fine pitch) (12
×
12)
μ
PD703212GC-xxx-8EU:
100-pin plastic LQFP (fine pitch) (14
×
14)
μ
PD703212YGC-xxx-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14)
μ
PD703213GC-xxx-8EU:
100-pin plastic LQFP (fine pitch) (14
×
14)
μ
PD703213YGC-xxx-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14)
μ
PD703214GC-xxx-8EU:
100-pin plastic LQFP (fine pitch) (14
×
14)
μ
PD703214YGC-xxx-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14)
μ
PD70F3214GC-8EU:
100-pin plastic LQFP (fine pitch) (14
×
14)
μ
PD70F3214YGC-8EU:
100-pin plastic LQFP (fine pitch) (14
×
14)
80-pin plastic TQFP (fine pitch) (12
×
12)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less, Exposure limit: 7 days
72 hours)
Note
(after that, prebake at 125°C for 10 to
IR35-107-2
VPS
Package peak temperature: 215°C, Time: 25 to 40 seconds (at 200°C or higher),
Count: Two times or less, Exposure limit: 7 days
72 hours)
Note
(after that, prebake at 125°C for 10 to
VP15-107-2
Partial heating
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).