
CHAPTER 28 RECOMMENDED SOLDERING CONDITIONS
User’s Manual U15862EJ3V0UD
747
Table 28-1. Surface Mounting Type Soldering Conditions (3/3)
(3)
μ
PD703216GJ-xxx-UEN:
μ
PD703216YGJ-xxx-UEN: 144-pin plastic LQFP (fine pitch) (20
×
20)
μ
PD703217GJ-xxx-UEN:
144-pin plastic LQFP (fine pitch) (20
×
20)
μ
PD703217YGJ-xxx-UEN: 144-pin plastic LQFP (fine pitch) (20
×
20)
144-pin plastic LQFP (fine pitch) (20
×
20)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less, Exposure limit: 3 days
72 hours)
Note
(after that, prebake at 125°C for 10 to
IR35-103-2
VPS
Package peak temperature: 215°C, Time: 25 to 40 seconds (at 200°C or higher),
Count: Two times or less, Exposure limit: 3 days
72 hours)
Note
(after that, prebake at 125°C for 10 to
VP15-103-2
Partial heating
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
(4)
μ
PD70F3217GJ- UEN:
μ
PD70F3217YGJ-UEN: 144-pin plastic LQFP (fine pitch) (20
×
20)
144-pin plastic LQFP (fine pitch) (20
×
20)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less, Exposure limit: 3 days
hours)
Note
(after that, prebake at 125°C for 36
IR35-363-2
VPS
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Two times or less, Exposure limit: 3 days
hours)
Note
(after that, prebake at 125°C for 36
VP15-363-2
Partial heating
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).