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參數(shù)資料
| 型號： | W25Q16DWSFIG |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | PROM |
| 英文描述： | 16M X 1 SPI BUS SERIAL EEPROM, PDSO16 |
| 封裝： | 0.300 INCH, GREEN, PLASTIC, SOIC-16 |
| 文件頁數(shù)： | 51/83頁 |
| 文件大?。?/td> | 1268K |
| 代理商： | W25Q16DWSFIG |
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W25Q16DW
Publication Release Date: April 01, 2011
- 55 -
Preliminary - Revision A
10.2.30 Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down / Device
ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device ID
instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code “90h”
followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond (EFh)
and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown
in Figure 29a & 29b. The Device ID values for the W25Q16DW is listed in Manufacturer and Device
Identification table. If the 24-bit address is initially set to 000001h the Device ID will be read first and then
followed by the Manufacturer ID. The Manufacturer and Device IDs can be read continuously, alternating
from one to the other. The instruction is completed by driving /CS high.
/CS
CLK
DI
(IO
0)
DO
(IO
1)
Mode 0
Mode 3
0
1
2
3
4
5
6
7
Instruction (90h)
High Impedance
8
9
10
28
29
30
31
Address (000000h)
23
22
21
3
2
1
0
Device ID
1
*
/CS
CLK
DI
(IO
0)
DO
(IO )
32
33
34
35
36
37
38
39
40
41
42
44
45
46
7
6
5
4
3
2
1
0
Manufacturer ID (EFh)
*
43
31
0
Mode 0
Mode 3
= MSB
*
Figure 29a. Read Manufacturer / Device ID Instruction (SPI Mode)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W25Q16DWSFIP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q16DWSNIG | 制造商:WINBOND 制造商全稱:Winbond 功能描述:1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q16DWSNIP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q16DWSSIG | 功能描述:IC FLASH SPI 16MBIT 8SOIC RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:SpiFlash® 標(biāo)準(zhǔn)包裝:2,500 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?（單線） 電源電壓:1.8 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬） 供應(yīng)商設(shè)備封裝:8-MSOP 包裝:帶卷 (TR) |
| W25Q16DWSSIP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
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