參數(shù)資料
型號: W25Q16DWSFIG
廠商: WINBOND ELECTRONICS CORP
元件分類: PROM
英文描述: 16M X 1 SPI BUS SERIAL EEPROM, PDSO16
封裝: 0.300 INCH, GREEN, PLASTIC, SOIC-16
文件頁數(shù): 74/83頁
文件大小: 1268K
代理商: W25Q16DWSFIG
W25Q16DW
- 76 -
L
12. PACKAGE SPECIFICATION
12.1 8-Pin SOIC 150-mil (Package Code SN)
c
θ
D
A1
A
e
b
SEATING PLANE
Y
0.25
GAUGE PLANE
E H
E
4
1
5
8
L
c
θ
D
A1
A
e
b
SEATING PLANE
Y
0.25
GAUGE PLANE
E H
E
E H
4
1
5
8
E
SYMBOL
MILLIMETERS
INCHES
Min
Max
Min
Max
A
1.35
1.75
0.053
0.069
A1
0.10
0.25
0.004
0.010
b
0.33
0.51
0.013
0.020
c
0.19
0.25
0.008
0.010
E
(3)
3.80
4.00
0.150
0.157
D
(3)
4.80
5.00
0.188
0.196
e
(2)
1.27 BSC
0.050 BSC
HE
5.80
6.20
0.228
0.244
Y
(4)
---
0.10
---
0.004
L
0.40
1.27
0.016
0.050
θ
10°
10°
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
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