參數(shù)資料
型號(hào)： W25Q32BVZEAG
廠商： WINBOND ELECTRONICS CORP
元件分類： PROM
英文描述： 32M X 1 SPI BUS SERIAL EEPROM, PDSO8
封裝： 8 X 6 MM, GREEN, WSON-8
文件頁數(shù)： 75/79頁
文件大?。?/td> 1090K
代理商： W25Q32BVZEAG
W25Q32BV
Publication Release Date: April 01, 2011
- 77 -
Revision F
10. ORDERING INFORMATION
W(1) 25Q 32B V xx(2)
I
= Industrial (-40°C to +85°C)
A = Automotive (-40°C to +105°C)
(3,4)
G =
Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb2O3)
P
=
Green Package with Status Register Power-Down & OTP enabled
SS = 8-pin SOIC 208-mil
ZP = 8-pad WSON 6x5mm
DA = 8-pin PDIP 300-mil
SF = 16-pin SOIC 300-mil
ZE = 8-pad WSON 8x6mm
TC = 24-ball TFBGA 8x6mm
V = 2.7V to 3.6V
32B = 32M-bit
25Q = SpiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O
W = Winbond
Notes:
1.
The “W” prefix is not included on the part marking.
2.
Only the 2
nd letter is used for the part marking; WSON package type ZP and ZE are not used for the part
marking.
3.
Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and
Reel (shape T) or Tray (shape S), when placing orders.
4.
For shipments with OTP feature enabled, please specify when placing orders.
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