
W986432DH
Publication Release Date: September 4, 2001
- 5 -
Revision A3
5. PIN DESCRIPTION
PIN NUMBER
PIN NAME
FUNCTION
DESCRIPTION
24, 25, 26, 27, 60, 61, 62, 63,
64, 65, 66
A0
A10
Address
Multiplexed pins for row and column address.
Row address: A0
A10. Column address:
A0
A7. A10 is sampled during a precharge
command to determine if all banks are to be
precharged or bank selected by BS0, BS1.
22, 23
BS0, BS1
Bank Select
Select bank to activate during row address
latch time, or bank to read/write during address
latch time.
2, 4, 5, 7, 8, 10, 11, 13, 31,
33, 34, 36, 37, 39, 40, 42, 45,
47, 48, 50, 51, 53, 54, 56, 74,
76, 77, 79, 80, 82, 83, 85
DQ0
DQ31
Data Input/
Output
Multiplexed pins for data output and input.
20
CS
Chip Select
Disable or enable the command decoder.
When command decoder is disabled, new
command is ignored and previous operation
continues.
19
RAS
Row Address
Strobe
Command input. When sampled at the rising
edge of the clock RAS , CAS and WE
define the operation to be executed.
18
CAS
Column
Address Strobe
Referred to RAS
17
WE
Write Enable
Referred to RAS
16, 28, 59, 71
DQM0
DQM3
Input/Output
Mask
The output buffer is placed at Hi-Z (with latency
of 2) when DQM is sampled high in read cycle.
In write cycle, sampling DQM high will block the
write operation with zero latency.
28
CLK
Clock Inputs
System clock used to sample inputs on the
rising edge of clock.
67
CKE
Clock Enable CKE controls the clock activation and
deactivation. When CKE is low, Power Down
mode, Suspend mode, or Self Refresh mode is
entered.
1, 15, 29, 43
V
CC
Power (+3.3V)
Power for input buffers and logic circuit inside
DRAM.
44, 58, 72, 86
V
SS
Ground
Ground for input buffers and logic circuit inside
DRAM.
3, 9, 35, 41, 49, 55, 75, 81
V
CCQ
Power (+3.3V)
for I/O Buffer
Separated power from VCC, to improve DQ
noise immunity.
6, 12, 32, 38, 46, 52, 78, 84
V
SSQ
Ground for I/O
Buffer
Separated ground from VSS, to improve DQ
noise immunity.
14, 21, 30, 57, 69, 70, 73
NC
No Connection
No connection