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參數(shù)資料
| 型號： | XC2S150-5FG256I |
| 廠商： | Xilinx Inc |
| 文件頁數(shù)： | 13/99頁 |
| 文件大小： | 0K |
| 描述： | IC FPGA 2.5V I-TEMP 256-FBGA |
| 標準包裝： | 90 |
| 系列： | Spartan®-II |
| LAB/CLB數(shù)： | 864 |
| 邏輯元件/單元數(shù)： | 3888 |
| RAM 位總計： | 49152 |
| 輸入/輸出數(shù)： | 176 |
| 門數(shù)： | 150000 |
| 電源電壓： | 2.375 V ~ 2.625 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | -40°C ~ 100°C |
| 封裝/外殼： | 256-BGA |
| 供應商設備封裝： | 256-FBGA（17x17） |
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Spartan-II FPGA Family: Functional Description
DS001-2 (v2.8) June 13, 2008
Module 2 of 4
Product Specification
20
R
By default, these operations are synchronized to CCLK.
The entire start-up sequence lasts eight cycles, called
C0-C7, after which the loaded design is fully functional. The
default timing for start-up is shown in the top half of
Figure 13. The four operations can be selected to switch on
any CCLK cycle C1-C6 through settings in the Xilinx
software. Heavy lines show default settings.
The bottom half of Figure 13 shows another commonly
used version of the start-up timing known as
Sync-to-DONE. This version makes the GTS, GSR, and
GWE events conditional upon the DONE pin going High.
This timing is important for a daisy chain of multiple FPGAs
in serial mode, since it ensures that all FPGAs go through
start-up together, after all their DONE pins have gone High.
Sync-to-DONE timing is selected by setting the GTS, GSR,
and GWE cycles to a value of DONE in the configuration
options. This causes these signals to transition one clock
cycle after DONE externally transitions High.
Serial Modes
There are two serial configuration modes: In Master Serial
mode, the FPGA controls the configuration process by
driving CCLK as an output. In Slave Serial mode, the FPGA
passively receives CCLK as an input from an external agent
(e.g., a microprocessor, CPLD, or second FPGA in master
mode) that is controlling the configuration process. In both
modes, the FPGA is configured by loading one bit per
CCLK cycle. The MSB of each configuration data byte is
always written to the DIN pin first.
See Figure 14 for the sequence for loading data into the
Spartan-II FPGA serially. This is an expansion of the "Load
Configuration Data Frames" block in Figure 11. Note that
CS and WRITE normally are not used during serial
configuration. To ensure successful loading of the FPGA,
do not toggle WRITE with CS Low during serial
configuration.
Figure 13: Start-Up Waveforms
Start-up CLK
Default Cycles
Sync to DONE
01
2
3
4
5
6
7
01
DONE High
23
4
56
7
Phase
Start-up CLK
Phase
DONE
GTS
GSR
GWE
DS001_13_090600
DONE
GTS
GSR
GWE
Figure 14: Loading Serial Mode Configuration Data
DS001_14_042403
No
Yes
End of
Configuration
Data File?
After INIT
Goes High
User Load One
Configuration
Bit on Next
CCLK Rising Edge
To CRC Check
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相關代理商/技術參數(shù) |
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| XC2S150-5FG456C | 功能描述:IC FPGA 2.5V 864 CLB'S 456-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-II 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA（27x27） |
| XC2S150-5FG456I | 功能描述:IC FPGA 2.5V I-TEMP 456-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-II 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA（27x27） |
| XC2S150-5FGG256C | 功能描述:IC SPARTAN-II FPGA 150K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-II 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA（27x27） |
| XC2S150-5FGG256I | 制造商:Xilinx 功能描述:FPGA SPARTAN-II 150K GATES 3888 CELLS 263MHZ 2.5V 256FBGA - Trays |
| XC2S150-5FGG456C | 功能描述:IC SPARTAN-II FPGA 150K 456-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-II 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA（27x27） |
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