參數(shù)資料
型號(hào)： XC2S150-5FG256I
廠商： Xilinx Inc
文件頁(yè)數(shù)： 37/99頁(yè)
文件大?。?/td> 0K
描述： IC FPGA 2.5V I-TEMP 256-FBGA
標(biāo)準(zhǔn)包裝： 90
系列： Spartan®-II
LAB/CLB數(shù)： 864
邏輯元件/單元數(shù)： 3888
RAM 位總計(jì)： 49152
輸入/輸出數(shù)： 176
門數(shù)： 150000
電源電壓： 2.375 V ~ 2.625 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 100°C
封裝/外殼： 256-BGA
供應(yīng)商設(shè)備封裝： 256-FBGA（17x17）
Spartan-II FPGA Family: Functional Description
DS001-2 (v2.8) June 13, 2008
Module 2 of 4
Product Specification
42
R
property. This property could have one of the following
seven values.
DRIVE=2
DRIVE=4
DRIVE=6
DRIVE=8
DRIVE=12 (Default)
DRIVE=16
DRIVE=24
Design Considerations
Reference Voltage (VREF) Pins
Low-voltage I/O standards with a differential amplifier input
buffer require an input reference voltage (VREF). Provide
the VREF as an external signal to the device.
The voltage reference signal is "banked" within the device
on a half-edge basis such that for all packages there are
eight independent VREF banks internally. See Figure 36,
page 39 for a representation of the I/O banks. Within each
bank approximately one of every six I/O pins is
automatically configured as a VREF input.
Within each VREF bank, any input buffers that require a
VREF signal must be of the same type. Output buffers of any
type and input buffers can be placed without requiring a
reference voltage within the same VREF bank.
Output Drive Source Voltage (VCCO) Pins
Many of the low voltage I/O standards supported by
Versatile I/Os require a different output drive source voltage
(VCCO). As a result each device can often have to support
multiple output drive source voltages.
The VCCO supplies are internally tied together for some
packages. The VQ100 and the PQ208 provide one
combined VCCO supply. The TQ144 and the CS144
packages provide four independent VCCO supplies. The
FG256 and the FG456 provide eight independent VCCO
supplies.
Output buffers within a given VCCO bank must share the
same output drive source voltage. Input buffers for LVTTL,
LVCMOS2, PCI33_3, and PCI 66_3 use the VCCO voltage
for Input VCCO voltage.
Transmission Line Effects
The delay of an electrical signal along a wire is dominated
by the rise and fall times when the signal travels a short
distance. Transmission line delays vary with inductance
and capacitance, but a well-designed board can experience
delays of approximately 180 ps per inch.
Transmission line effects, or reflections, typically start at
1.5" for fast (1.5 ns) rise and fall times. Poor (or
non-existent) termination or changes in the transmission
line impedance cause these reflections and can cause
additional delay in longer traces. As system speeds
continue to increase, the effect of I/O delays can become a
limiting factor and therefore transmission line termination
becomes increasingly more important.
Termination Techniques
A variety of termination techniques reduce the impact of
transmission line effects.
The following lists output termination techniques:
None
Series
Parallel (Shunt)
Series and Parallel (Series-Shunt)
Input termination techniques include the following:
None
Parallel (Shunt)
These termination techniques can be applied in any
combination. A generic example of each combination of
termination methods appears in Figure 41.
Simultaneous Switching Guidelines
Ground bounce can occur with high-speed digital ICs when
multiple outputs change states simultaneously, causing
undesired transient behavior on an output, or in the internal
logic. This problem is also referred to as the Simultaneous
Switching Output (SSO) problem.
Ground bounce is primarily due to current changes in the
combined inductance of ground pins, bond wires, and
Figure 41: Overview of Standard Input and Output
Termination Methods
DS001_41_032300
Unterminated
Double Parallel Terminated
Series-Parallel Terminated Output
Driving a Parallel Terminated Input
Series Terminated Output Driving
a Parallel Terminated Input
Unterminated Output Driving
a Parallel Terminated Input
V
TT
V
REF
V
REF
V
REF
V
REF
V
TT
V
TT
V
TT
V
TT
V
TT
Series Terminated Output
V
REF
Z=50
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XC2S150-5FG456C 功能描述:IC FPGA 2.5V 864 CLB'S 456-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
XC2S150-5FG456I 功能描述:IC FPGA 2.5V I-TEMP 456-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
XC2S150-5FGG256C 功能描述:IC SPARTAN-II FPGA 150K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
XC2S150-5FGG256I 制造商:Xilinx 功能描述:FPGA SPARTAN-II 150K GATES 3888 CELLS 263MHZ 2.5V 256FBGA - Trays
XC2S150-5FGG456C 功能描述:IC SPARTAN-II FPGA 150K 456-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
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