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參數(shù)資料
| 型號： | 2495 |
| 廠商： | Linear Technology Corporation |
| 英文描述： | 16-Bit 8-/16-Channel ツヒ ADC with PGA, Easy Drive and I2C Interface |
| 中文描述： | 16位8-/16-ChannelツヒADC，帶PGA巡回賽，輕松驅(qū)動和I2C接口 |
| 文件頁數(shù)： | 31/32頁 |
| 文件大?。?/td> | 558K |
| 代理商： | 2495 |
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LTC2495
31
2495f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
UHF Package
38-Lead Plastic QFN (5mm × 7mm)
(Reference LTC DWG # 05-08-1701)
5.00
±
0.10
(2 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE
OUTLINE M0-220 VARIATION WHKD
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
PIN 1
TOP MARK
(SEE NOTE 6)
0.40
±
0.10
37
1
2
38
BOTTOM VIEW—EXPOSED PAD
5.15
±
0.10
(2 SIDES)
7.00
±
0.10
(2 SIDES)
0.75
±
0.05
R = 0.115
TYP
0.25
±
0.05
0.50 BSC
(UH) QFN 0205
0.200 REF
0.00 – 0.05
0.200 REF
0.00 – 0.05
RECOMMENDED SOLDER PAD LAYOUT
3.15
±
0.10
(2 SIDES)
0.40
±
0.10
0.75
±
0.05
0.70
±
0.05
0.50 BSC
5.15
±
0.05 (2 SIDES)
6.10
±
0.05 (2 SIDES)
7.50
±
0.05 (2 SIDES)
3.15
±
0.05
(2 SIDES)
4.10
±
0.05
(2 SIDES)
5.50
±
0.05
(2 SIDES)
0.25
±
0.05
PACKAGE
OUTLINE
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 NOTCH
R = 0.30 TYP OR
0.35
×
45
°
CHAMFER
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