參數(shù)資料
型號: 25C256
廠商: Microchip Technology Inc.
英文描述: 256K 5.0V SPI Bus Serial EEPROM(4.5~5.5V,256K位,SPI總線串行EEPROM)
中文描述: 256K 5.0V SPI總線串行EEPROM(4.5?5.5V的,256K位和SPI總線串行EEPROM的)
文件頁數(shù): 161/170頁
文件大?。?/td> 4191K
代理商: 25C256
2003 Microchip Technology Inc.
Preliminary
DS40300C-page 159
PIC16F62X
K04-051 18-Lead Plastic Small Outline (SO) – Wide, 300 mil
Foot Angle
Lead Thickness
φ
c
0
4
8
0
4
8
15
12
0
15
12
0
β
Mold Draft Angle Bottom
15
12
0
15
12
0
α
Mold Draft Angle Top
0.51
0.42
0.36
.020
.017
.014
B
Lead Width
0.30
0.27
0.23
.012
.011
.009
1.27
0.84
0.41
.050
.033
.016
L
Foot Length
0.74
0.50
0.25
.029
.020
.010
h
Chamfer Distance
11.73
11.53
11.33
.462
.454
.446
D
Overall Length
7.59
7.49
7.39
.299
.295
.291
E1
Molded Package Width
10.67
10.34
10.01
.420
.407
.394
E
Overall Width
0.30
0.20
0.10
.012
.008
.004
A1
Standoff
§
2.39
2.31
2.24
.094
.091
.088
A2
Molded Package Thickness
2.64
2.50
2.36
.104
.099
.093
A
Overall Height
1.27
.050
p
Pitch
18
18
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
L
β
c
φ
h
45
°
1
2
D
p
n
B
E1
E
α
A2
A1
A
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-051
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