參數(shù)資料
型號(hào)： 6PAIC3106IRGZRQ1
廠商： Texas Instruments
文件頁(yè)數(shù)： 60/103頁(yè)
文件大小： 0K
描述： IC AUDIO CODEC STEREO 48-QFN
標(biāo)準(zhǔn)包裝： 1
類型： 立體聲音頻
數(shù)據(jù)接口： 串行
分辨率（位）： 24 b
ADC / DAC 數(shù)量： 2 / 2
三角積分調(diào)變： 是
S/N 比，標(biāo)準(zhǔn) ADC / DAC (db)： 92 / 102（差分），92 / 95（單端）
動(dòng)態(tài)范圍，標(biāo)準(zhǔn) ADC / DAC (db)： 91 / 99（差分），91 / 92（單端）
電壓 - 電源，模擬： 2.7 V ~ 3.6 V
電壓 - 電源，數(shù)字： 1.1 V ~ 3.6 V
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 48-VFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝： 48-VQFN 裸露焊盤（7x7）
包裝： 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁(yè)面： 1077 (CN2011-ZH PDF)
其它名稱： 296-25253-6
SLAS663B – AUGUST 2009 – REVISED OCTOBER 2012
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1) (2)
AVDD_DAC to AVSS_DAC, DRVDD to DRVSS, AVSS_ADC
–0.3 V to 3.9 V
AVDD to DRVSS
–0.3 V to 3.9 V
IOVDD to DVSS
–0.3 V to 3.9 V
DVDD to DVSS
–0.3 V to 2.5 V
AVDD_DAC to DRVDD
–0.1 V to 0.1 V
Digital input voltage to DVSS
–0.3 V to IOVDD + 0.3 V
Analog input voltage to AVSS_ADC
–0.3 V to AVDD + 0.3 V
Operating temperature range
–40°C to 85°C
Storage temperature range
–65°C to 105°C
TJ Max
Junction temperature
105°C
Power dissipation
(TJ Max – TA)/θJA
Human-body model
1500 V
ESD
Electrostatic discharge rating
Machine model
150 V
Charged-device model
1000 V
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
ESD compliance tested to EIA/JESD22-A114-B and passed.
PACKAGE THERMAL RATINGS
(1)
PARAMETER
RθJP
(1)
3.5°C/W
ΨJT
(2)
2°C/W
RθJA
(3)
24°C/W
RθJA
(4)
85°C/W
(1)
RθJP is the internal thermal resistance from junction to the thermal pad. It is required to limit the power dissipation within the device to
500 mW in all cases, including temperatures below 25°C. The TLV320AIC3106 must be soldered down to the copper (ground plane)
under the device to meet the thermal requirements.
(2)
ΨJT is defined by the following formula: ΨJT = [T (Junction) – T (Center of top of the case)]/(Total power)
(3)
Thermal resistance on a JEDEC high-K board with no airflow. See the JESD 51 standard for a detailed description.
(4)
Thermal resistance on a JEDEC low-K board with no airflow. See the JESD 51 standard for a detailed description.
SYSTEM THERMAL CHARACTERISTICS
Power Rating at 25°C, mW
Power Rating, mW
Derating Factor, °C/W
High-K Board
500
500 at 80°C
33
Low-K Board
500
500 at 30°C
104
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
AVDD_DAC, DRVDD(1) Analog supply voltage
2.7
3.3
3.6
V
DVDD(1)
Digital core supply voltage
1.65
1.8
1.95
V
IOVDD(1)
Digital I/O supply voltage
1.1
1.8
3.6
V
VI
Analog full-scale 0-dB input voltage (DRVDD1 = 3.3 V)
0.707
VRMS
Stereo line output load resistance
10
k
Stereo headphone output load resistance
16
Digital output load capacitance
10
pF
TA
Operating free-air temperature
–40
85
°C
(1)
Analog voltage values are with respect to AVSS_ADC, AVSS_DAC, DRVSS; digital voltage values are with respect to DVSS.
6
Copyright 2009–2012, Texas Instruments Incorporated
Product Folder Links: TLV320AIC3106-Q1
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