參數(shù)資料
型號： 73S1217F-EB-LITE
廠商： Maxim Integrated Products
文件頁數(shù)： 45/93頁
文件大?。?/td> 0K
描述： BOARD EVAL 73S1217F CBL/DOC/CD
產品培訓模塊： Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標準包裝： 1
系列： *
UG_12xxF_016
73S12xxF Software User Guide
Rev. 1.50
5
1
Introduction
The Teridian Semiconductor Corporation 73S12xxF single-chip Smart Card Terminal Controllers consist
of the 73S1209F, 73S1210F, 73S1215F and 73S1217F. These System-on-Chip devices provide the
functions necessary to build a low-cost smart card terminal.
The 73S12xxF Evaluation Board allows development of an embedded application in conjunction with an
In-Circuit Emulator (ICE). An application can be programmed in either ANSI C or 80515 assembly
language using this evaluation board.
Teridian provides a development Toolkit that includes a set of libraries (Application Programming
Interface or API). The API is written in ANSI C to control all the features present on the evaluation
boards. These libraries include functions to manage the low-level 80515 core functions such as memory,
clock, power modes, interrupts; and high-level functions such as the Liquid Crystal Display (LCD),
keyboard, Real-Time Clock (RTC), smart card interfaces, Universal Serial Bus (USB)/Serial interfaces and
I/Os. These APIs reduce development time dramatically, since they allow the developer to focus on
developing the application without dealing with the low-level layer such as hardware control, timing, etc.
This document describes the Toolkit’s hierarchical layers and how to use them.
Certain function blocks (such as USB and RTC) are not available on all 73S12xxF devices. As a result,
the related APIs can not be used with some ICs. Refer to the data sheets for further details.
This document applies to the following components:
LAPI Version 4.00 (DFU), LAPI Version 3.30 (BL), LAPI Version 2.30 (non-BL)
HAPI Version 4.00 (DFU), HAPI Version 3.30 (BL), HAPI Version 2.40 (non-BL)
Serial Pseudo-CCID Application Version 3.1
USB CCID Application Version 2.1 (DFU), USB CCID Application Version 1.5 (non-DFU)
Devices: 1215A05, 1217A06 and 1210/1209A02
1.1
Acronyms
APDU
Application Protocol Data Unit
API
Application Programming Interface
ATR
Answer To Reset
BL
Boot Loader
CCID
Integrated Circuit Card Interface Device
COM
Communication Port
DFU
Device Firmware Upgrade
DTK
Development ToolKit
DTM
Device Test Manager
EMV
Euro, MasterCard
, Visa
HAPI
High-level API
HCT
Hardware Compatibility Test
ICC
Integrated Circuit Card
ISO
International Standards Organization
ISP
In-System Programming
JICSAP
Japan IC Card System Application council
LAPI
Low-level API
LAPIE
Low-level API exerciser
LCD
Liquid Crystal Display
Non-BL
Non Boot Loader
PC
Personal Computer
PIN
Personal Indentification
RAM
Random Access Memory
ROM
Read Only Memory
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相關代理商/技術參數(shù)
參數(shù)描述
73S1217F-IMR/F 制造商:TERIDIAN 制造商全稱:TERIDIAN 功能描述:Bus-Powered 80515 System-on-Chip with USB, ISO 7816 / EMV, PINpad and More
73S13B 制造商:QUARTZCOM 制造商全稱:QUARTZCOM the communications company 功能描述:-20 ~ +70 °C commercia l application -30 ~ +75 °C on request
73S5040G01X0A 制造商:NEX Computers 功能描述:INTEL 40GB SSD - Bulk
73S8009C 制造商:TERIDIAN 制造商全稱:TERIDIAN 功能描述:Versatile Power Management and Smart Card Interface IC
73S8009C-20IM/F 功能描述:輸入/輸出控制器接口集成電路 Smart Card Interface IC RoHS:否 制造商:Silicon Labs 產品: 輸入/輸出端數(shù)量: 工作電源電壓: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-64 封裝:Tray
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