參數(shù)資料
型號(hào)： AD9739A-FMC-EBZ
廠商： Analog Devices Inc
文件頁數(shù)： 63/64頁
文件大小： 0K
描述： BOARD EVAL W/FMC CONN FPGA DEV
設(shè)計(jì)資源： AD9739A-FMC-EBZ Gerber Files
AD9739A-FMC-EBZ Layout
標(biāo)準(zhǔn)包裝： 1
系列： TxDAC®
DAC 的數(shù)量： 1
位數(shù)： 14
采樣率（每秒）： 2.5G
數(shù)據(jù)接口： 串行，SPI?
DAC 型： 電流
工作溫度： -40°C ~ 85°C
已供物品： 板
已用 IC / 零件： AD9739A
AD9737A/AD9739A
Data Sheet
Rev. | Page 8 of 64
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
VDDA to VSSA
0.3 V to +3.6 V
VDD33 to VSS
0.3 V to +3.6 V
VDD to VSS
0.3 V to +1.98 V
VDDC to VSSC
0.3 V to +1.98 V
VSSA to VSS
0.3 V to +0.3 V
VSSA to VSSC
0.3 V to +0.3 V
VSS to VSSC
0.3 V to +0.3 V
DACCLK_P, DACCLK_N to VSSC
0.3 V to VDDC + 0.18 V
DCI, DCO to VSS
0.3 V to VDD33 + 0.3 V
LVDS Data Inputs to VSS
0.3 V to VDD33 + 0.3 V
IOUTP, IOUTN to VSSA
1.0 V to VDDA + 0.3 V
I120, VREF to VSSA
0.3 V to VDDA + 0.3 V
IRQ, CS, SCLK, SDO, SDIO, RESET to VSS
0.3 V to VDD33 + 0.3 V
Junction Temperature
150°C
Storage Temperature Range
65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type
θJA
θJC
Unit
160-Ball CSP_BGA
31.2
7.0
°C/W1
1
With no airflow movement.
ESD CAUTION
C
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