Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely" />
參數(shù)資料
型號(hào): DS3254DK
廠商: Maxim Integrated Products
文件頁(yè)數(shù): 69/71頁(yè)
文件大小: 0K
描述: KIT DEMO FOR DS3254
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
設(shè)計(jì)資源: DS3254DK Gerber Files
標(biāo)準(zhǔn)包裝: 1
主要目的: 電信,線路接口單元(LIU)
已用 IC / 零件: DS3254
已供物品: 板,CD
DS3251/DS3252/DS3253/DS3254
71 of 71
Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim/Dallas Semiconductor product.
No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time.
Ma x i m In tegra t ed P roduc ts , 1 2 0 S a n Ga brie l D r iv e , Sun n y vale , CA 94 086 40 8 -7 3 7 -76 00
2006 Maxim Integrated Products
Printed USA
The Maxim logo is a registered trademark of Maxim Integrated Products, Inc. The Dallas logo is a registered trademark of Dallas Semiconductor Corporation.
20.
THERMAL INFORMATION
Table 20-A. Thermal Properties, Natural Convection
PARAMETER
MIN
TYP
MAX
Ambient Temperature (Note 1)
-40
°C
+85
°C
Junction Temperature
-40
°C
+125
°C
Theta-JA (
θJA), Still Air (Note 2)
22.4
°C/W
Psi-JB
9.2
°C/W
Psi-JT
1.6
°C/W
Note 1:
The package is mounted on a four-layer JEDEC standard test board with no airflow and dissipating maximum power.
Note 2:
Theta-JA (
θJA) is the junction to ambient thermal resistance, when the package is mounted on a four-layer JEDEC standard test board
with no airflow and dissipating maximum power.
Table 20-B. Theta-JA (
θJA) vs. Airflow
FORCED AIR (METERS PER
SECOND)
THETA-JA (
θJA)
0
22.4
°C/W
1
19.0
°C/W
2.5
17.2
°C/W
21.
REVISION HISTORY
REVISION
DESCRIPTION
031805
New Product Release (DS3254)
061705
New Product Release (DS3251/DS3252/DS3253)
030106
Added requirement that ALE pin must be high when using the SPI interface: Figure 4-1 (at the
bottom), the second paragraph of Section 5, Table 6-F, the first paragraph of Section 15.2,
Table 18-A, Figure 18-3, Figure 18-6, Figure 18-9, and Figure 18-12.
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