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| 型號： | IDT88P8341BHI |
| 廠商： | IDT, Integrated Device Technology Inc |
| 文件頁數(shù)： | 20/96頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC SPI3-SPI4 EXCHANGE 820-PBGA |
| 標準包裝： | 24 |
| 系列： | * |
| 其它名稱： | 88P8341BHI |
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IDT88P8341 SPI EXCHANGE SPI-3 TO SPI-4
INDUSTRIALTEMPERATURERANGE
APRIL 10, 2006
SPI-4 egress data bursts
The PFP produces fragments of up to N*16 bytes. N is defined by the
MAX_BURST_HorMAX_BURST_SparameterassociatedwitheachLID.For
a high priority (starving) LID the MAX_BURST_S parameter is used. For a low
priority (hungry) LID the MAX_BURST_H parameter is used. The PFP may
not fill the buffers to the level granted when a new segment needs to be used
intheSPI3-4buffermemoryorwhenthelastfragmentofapacketiscopiedinto
thebuffer.TheinformationreceivedovertheFIFOstatuschannelisinterpreted
as status or credit information as selected by the CREDIT_EN flag in Table 78,
SPI-3 to SPI-4 flow control register (0x01). If the status mode is used, data will
be egressed until the status is changed. If the credit mode is used, the SPI-4
egresswillissueonlyonecredit’sworthdataburstandthenwaitforanothercredit
from the status channel before issuing another LID burst.
SPI-4 egress FIFO status channel updates
The SPI-4 egress FIFO Status Channel Module continuously verifies the
status information for the LIDs associated to SPI-4 logical ports. The PFP
searchesandselectsaLID,fetchestheassociatedinformationandqueuesdata
to the SPI-4 egress. The obsolete buffer segment is returned to the free buffer
segment pool (unless the repeat test feature is enabled). Searching the LID to
beservedisperformedforbothahighpriorityandalowpriorityLID.Thepriority
is defined by the status received from the SPI-4 egress module.
SPI-3 ingress logical port mapping
The SPI-3 interface has an associated SPI-3 ingress LP to LID map, (See
Table49)forthepurposeofdirectingthepacketfragmentsfromtheSPI-3ingress
to its associated SPI-3 ingress main memory buffer segment pool. The SPI-3
LID map has 256 entries, one per SPI-3 LP, but only 64 LPs are supported on
the SPI-3 interface at any one time. The SPI-3 interface has an enable bit, as
well as the ability to reverse the bit ordering within bytes of the interface. The
packetfragmentlengthisassociatedwiththeSPI-3interface.Theallowedrange
is0to255bytesperpacketfragment.Thelastfragmentofapacketcanbeshorter
than the programmed fragment size. The SPI-3 port can be independently set
for either Link or PHY mode of operation.
SPI-3 ingress LID associated control
EachLIDontheSPI-3interfacehastheabilitytobeprogrammedforminimum
and maximum packet length. The minimum packet length can be set from 0 to
255bytesinonebyteincrements.Themaximumpacketlengthcanbesetfrom
0to16,383bytesinonebyteincrements.EachLIDcanbeenabledanddisabled
independently.
Figure 14. SPI-3 ingress LP to LID map
6372 drw15
LID
BRV
EN
256 LPs
[LP] = LID | EN | BRV
LID: Logical Identifier
EN: LID Enable
BRV: Bit Reversal
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| IDT88P8342BHGI | 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 類別:集成電路 (IC) >> 專用 IC 系列:* 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:1 系列:- 類型:調(diào)幀器 應(yīng)用:數(shù)據(jù)傳輸 安裝類型:表面貼裝 封裝/外殼:400-BBGA 供應(yīng)商設(shè)備封裝:400-PBGA（27x27） 包裝:散裝 |
| IDT88P8342BHI | 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 類別:集成電路 (IC) >> 專用 IC 系列:* 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:1 系列:- 類型:調(diào)幀器 應(yīng)用:數(shù)據(jù)傳輸 安裝類型:表面貼裝 封裝/外殼:400-BBGA 供應(yīng)商設(shè)備封裝:400-PBGA（27x27） 包裝:散裝 |
| IDT88P8344 | 制造商:IDT 制造商全稱:Integrated Device Technology 功能描述:SPI EXCHANGE 4 x SPI-3 TO SPI-4 Issue 1.0 |
| IDT88P8344BHGI | 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 類別:集成電路 (IC) >> 專用 IC 系列:* 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:1 系列:- 類型:調(diào)幀器 應(yīng)用:數(shù)據(jù)傳輸 安裝類型:表面貼裝 封裝/外殼:400-BBGA 供應(yīng)商設(shè)備封裝:400-PBGA（27x27） 包裝:散裝 |
| IDT88P8344BHI | 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 類別:集成電路 (IC) >> 專用 IC 系列:* 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:1 系列:- 類型:調(diào)幀器 應(yīng)用:數(shù)據(jù)傳輸 安裝類型:表面貼裝 封裝/外殼:400-BBGA 供應(yīng)商設(shè)備封裝:400-PBGA（27x27） 包裝:散裝 |
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