參數(shù)資料
型號： ISP1181BDGG,112
廠商： NXP SEMICONDUCTORS
元件分類： 總線控制器
英文描述： UNIVERSAL SERIAL BUS CONTROLLER, PDSO48
封裝： 6.10 MM, PLASTIC, MO-153, SOT-362-1, TSSOP-48
文件頁數(shù)： 62/70頁
文件大?。?/td> 341K
代理商： ISP1181BDGG,112
Philips Semiconductors
ISP1181B
Full-speed USB peripheral controller
Product data
Rev. 02 — 07 December 2004
65 of 70
9397 750 13958
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
25. Soldering
25.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for ne
pitch SMDs. In these situations reow soldering is recommended. In these situations
reow soldering is recommended.
25.2 Reow soldering
Reow soldering requires solder paste (a suspension of ne solder particles, ux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reow peak temperatures range from 215 to 270
°C depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
below 225
°C (SnPb process) or below 245 °C (Pb-free process)
– for all BGA, HTSSON..T and SSOP..T packages
– for packages with a thickness
≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a volume
≥ 350 mm3 so called
thick/large packages.
below 240
°C (SnPb process) or below 260 °C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all
times.
25.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
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相關代理商/技術(shù)參數(shù)
參數(shù)描述
ISP1181BDGG-T 制造商:ST-Ericsson 功能描述:USB Peripheral Controller 48-Pin TSSOP T/R
ISP1181BDGGTM 功能描述:IC USB HOST CTRL FLL-SPD 48TSSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標準包裝:4,900 系列:- 控制器類型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤 供應商設備封裝:36-QFN（6x6） 包裝:* 其它名稱:Q6396337A
ISP1181BPC 制造商:ST-Ericsson 功能描述:Full-Speed Universal Serial Bus Peripheral Controller
ISP1181BS 制造商:未知廠家 制造商全稱:未知廠家 功能描述:BUS CONTROLLER
ISP1181DGG 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Full-speed Universal Serial Bus interface device
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