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參數(shù)資料
| 型號： | ISP1181BDGG,112 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 總線控制器 |
| 英文描述： | UNIVERSAL SERIAL BUS CONTROLLER, PDSO48 |
| 封裝： | 6.10 MM, PLASTIC, MO-153, SOT-362-1, TSSOP-48 |
| 文件頁數(shù)： | 64/70頁 |
| 文件大?。?/td> | 341K |
| 代理商： | ISP1181BDGG,112 |
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Philips Semiconductors
ISP1181B
Full-speed USB peripheral controller
Product data
Rev. 02 — 07 December 2004
67 of 70
9397 750 13958
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reow
soldering with peak temperature exceeding 217
°C ± 10 °C measured in the atmosphere of the reow
oven. The package body peak temperature must be kept as low as possible.
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or
larger than 0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than
0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on ex foil. However, the image sensor package can be mounted by the client on a ex
foil by using a hot bar soldering process. The appropriate soldering prole can be provided on
request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISP1181BDGG-T | 制造商:ST-Ericsson 功能描述:USB Peripheral Controller 48-Pin TSSOP T/R |
| ISP1181BDGGTM | 功能描述:IC USB HOST CTRL FLL-SPD 48TSSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標準包裝:4,900 系列:- 控制器類型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:36-QFN（6x6） 包裝:* 其它名稱:Q6396337A |
| ISP1181BPC | 制造商:ST-Ericsson 功能描述:Full-Speed Universal Serial Bus Peripheral Controller |
| ISP1181BS | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:BUS CONTROLLER |
| ISP1181DGG | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Full-speed Universal Serial Bus interface device |
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