參數(shù)資料
型號: K4S161622E-TC10
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 1M x 16 SDRAM
中文描述: 100萬× 16內(nèi)存
文件頁數(shù): 20/42頁
文件大?。?/td> 675K
代理商: K4S161622E-TC10
K4S161622E
CMOS SDRAM
Rev 1.1 Jan '03
*Note :
1. Active power down : one or both banks active state.
2. Precharge power down : both banks precharge state.
3. The auto refresh is the same as CBR refresh of conventional DRAM.
No precharge commands are required after auto refresh command.
During t
RFC
from auto refresh command, any other command can not be accepted.
4. Before executing auto/self refresh command, both banks must be idle state.
5. MRS, Bank Active, Auto/Self Refresh, Power Down Mode Entry.
6. During self refresh mode, refresh interval and refresh operation are perfomed internally.
After self refresh entry, self refresh mode is kept while CKE is low.
During self refresh mode, all inputs expect CKE will be don't cared, and outputs will be in Hi-Z state.
For the time interval of t
RFC
from self refresh exit command, any other command can not be accepted. Before/After self refresh mode, burst
auto refresh cycle (2048 cycles) is recommended.
10. Clock Suspend Exit & Power Down Exit
CLK
CKE
CMD
RD
1) Clock Suspend (=Active Power Down) Exit
tSS
CLK
CKE
CMD
2) Power Down (=Precharge Power Down)
Note 1
Note 5
Internal
CLK
NOP
tSS
Note 2
Internal
CLK
11. Auto Refresh & Self Refresh
CLK
CMD
1) Auto Refresh & Self Refresh
CKE
PRE
AR
CMD
Note 4
tRP
tRFC
ó
ó
ó
ó
CLK
CMD
2) Self Refresh
CKE
PRE
SR
CMD
Note 4
tRP
tRFC
ó
ó
Note 6
Note 3
ó
ACT
相關(guān)PDF資料
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